Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of pyrazole compounds and bisepoxides

Patent metadata

Field	Value
Publication number	US-2017370014-A1
Application number	US-201715621410-A
Country	US
Kind code	A1
Filing date	Jun 13, 2017
Priority date	Jun 27, 2016
Publication date	Dec 28, 2017
Grant date	—

Abstract

Electroplating methods enable the plating of photoresist defined features which have substantially uniform morphology. The electroplating methods include copper electroplating baths with reaction products of pyrazole compounds and bisepoxides to electroplate the photoresist defined features. Such features include pillars, bond pads and line space features.

First claim

What is claimed is:

1 . A method comprising:
a) providing a substrate comprising a layer of photoresist, wherein the layer of photoresist comprises a plurality of apertures; b) providing a copper electroplating bath comprising one or more reaction products of one or more pyrazole compounds and one or more bisepoxides; an electrolyte; one or more accelerators; and one or more suppressors; c) immersing the substrate comprising the layer of photoresist with the plurality of apertures in the copper electroplating bath; and d) electroplating a plurality of copper photoresist defined features in the plurality of apertures, the plurality of photoresist defined features comprise an average % TIR of 0% to 10%.

2 . The method of claim 1 , wherein a % WID of the plurality of photoresist defined features is from 0% to 10%.

3 . The method of claim 1 , wherein the one or more pyrazole compounds have a formula:

where R 1 , R 2 and R 3 are independently chosen from hydrogen, linear or branched (C 1 -C 10 )alkyl; hydroxyl; linear or branched (C 1 -C 10 )alkoxy; linear or branched hydroxy(C 1 -C 10 )alkyl; linear or branched alkoxy(C 1 -C 10 )alkyl; linear or branched, carboxy(C 1 -C 10 )alkyl, linear or branched amino(C 1 -C 10 )alkyl; and substituted or unsubstituted phenyl.

4 . The method of claim 1 wherein the one or more bisepoxides are chosen from compounds having formula:

wherein R 4 and R 5 may be the same or different and are chosen from hydrogen and (C 1 -C 4 )alkyl; R 6 and R 7 may be the same of different and are chosen from hydrogen, methyl and hydroxyl; m=1-6 and n=1-20.

5 . The method of claim 1 , wherein the reaction product is in amounts of 0.25 ppm to 1000 ppm.

6 . The method of claim 1 , wherein electroplating is done at a current density of 0.25 ASD to 40 ASD.

7 . The method of claim 1 , wherein the one or more copper photoresist defined features are pillars, bond pads or line space features.

8 . An array of photoresist defined features on a substrate comprising an average % TIR of 0% to 10% and a % WID of 0% to 10%.

Assignees

• Rohm & Haas Elect Mat

Inventors

• Pokhrel Ravi
• Thorseth Matthew
• Byrnes James
• Scalisi Mark
• Niazimbetova Zuhra
• Dziewiszek Joanna

Classifications

• C25D3/38 Primary

  of copper · CPC title

• C25D5/022

  using masking means · CPC title

• C25D7/123

  Semiconductors first coated with a seed layer or a conductive layer · CPC title

• C25D3/52

  characterised by the organic bath constituents used · CPC title

• H05K3/205

  using a pattern electroplated or electroformed on a metallic carrier · CPC title