Electroplating solutions

US2025305175A1 · US · A1

Patent metadata
FieldValue
Publication numberUS-2025305175-A1
Application numberUS-202519235940-A
CountryUS
Kind codeA1
Filing dateJun 12, 2025
Priority dateDec 18, 2020
Publication dateOct 2, 2025
Grant date

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  1. Title

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  5. First independent claim

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Abstract

Official abstract text for this publication.

Aqueous electroplating solution for alkaline electroplating, comprising: [M(NH3)4]2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comprising phosphorus in an amount of less than 5 g/L; compounds comprising boron in an amount of less than 5 g/L. The invention also relates to an electroplating bath comprising the electroplating solution, and a method of forming a metal layer on a substrate by electroplating using the electroplating solution.

First claim

Opening claim text (preview).

What is claimed: 1 . An aqueous electroplating solution for alkaline electroplating, comprising: [Pt(NH 3 ) 4 ] 2+ ions; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the molar ratio of Pt: (bicarbonate+carbonate) is approximately 1:2; and wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comprising phosphorus in an amount of less than 5 g/L; compounds comprising boron in an amount of less than 5 g/L. 2 . The aqueous electroplating solution according to claim 1 , wherein the concentration of Pt in the solution is 1 to 30 g/litre, on a metal basis. 3 . The aqueous electroplating solution according to claim 1 , wherein the concentration of Pt in the solution is 5 to 30 g/litre, on a metal basis. 4 . The aqueous electroplating solution according to claim 1 , wherein the concentration of Pt in the solution is 5 to 25 g/litre, on a metal basis. 5 . The aqueous electroplating solution according to claim 1 , wherein the pH of the solution is 8 to 14. 6 . The aqueous electroplating solution according to claim 1 , comprising a pH adjusting agent selected from the group consisting of ammonia, urea, an alkylammonium hydroxide, ammonium hydroxide, ammonium bicarbonate and ammonium carbonate. 7 . The aqueous electroplating solution according to claim 1 , wherein the content of alkali metals is less than 0.1 g/L. 8 . The aqueous electroplating solution according to claim 1 , wherein the content of halide ions in the electroplating solution is less than 1 g/L. 9 . The aqueous electroplating solution according to claim 1 , wherein the content of nitrite ions in the electroplating solution is less than 0.5 g/L. 10 . The aqueous electroplating solution according to claim 1 , wherein the content of nitrate ions in the electroplating solution is less than 0.5 g/L. 11 . The aqueous electroplating solution according to claim 1 , wherein the content of compounds containing silicon is less than 0.5 g/L. 12 . The aqueous electroplating solution according to claim 1 , wherein the content of compounds containing sulfur is less than 0.5 g/L.

Assignees

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Classifications

  • C25D3/50Primary

    of platinum group metals · CPC title

  • Jewels; Clockworks; Coins · CPC title

  • C25D3/52Primary

    characterised by the organic bath constituents used · CPC title

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What does patent US2025305175A1 cover?
Aqueous electroplating solution for alkaline electroplating, comprising: [M(NH3)4]2+ ions, wherein M is selected from the group consisting of Pd or Pt; and organic anions selected from the group consisting of bicarbonate, carbonate, or a mixture thereof; wherein the following species, if present, are present in the following amounts: alkali metals in an amount of less than 5 g/L; compounds comp…
Who is the assignee on this patent?
Johnson Matthey Plc
What technology area does this patent fall under?
Primary CPC classification C25D3/50. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Thu Oct 02 2025 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).