Bonding stage and bonding apparatus comprising the same
US-10058952-B2 · Aug 28, 2018 · US
Cooling, heat sink or heat shielding means
Cooling, heat sink or heat shielding means · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B23K3/085 |
| Official title | {Cooling, heat sink or heat shielding means} |
| Display label | Cooling, heat sink or heat shielding means |
| Total patents | 143 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is growing.
| Year | Patents |
|---|---|
| 2015 | 10 |
| 2016 | 19 |
| 2017 | 20 |
| 2018 | 12 |
| 2019 | 9 |
| 2020 | 8 |
| 2021 | 12 |
| 2022 | 13 |
| 2023 | 11 |
| 2024 | 7 |
| 2025 | 18 |
| 2026 | 4 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Soldering method, soldering apparatus, and method for maintaining solder wetting of jet nozzle
US-2018221978-A1 · Aug 9, 2018 · US
Wire splicing device, wire splicing method, and method for manufacturing splice structure
US-10044176-B2 · Aug 7, 2018 · US
Flux Applying Device and Solder
US-2018185967-A1 · Jul 5, 2018 · US
Wire splicing device, wire splicing method, and method for manufacturing splice structure
US-10014671-B2 · Jul 3, 2018 · US
Viscous fluid coating device
US-9969023-B2 · May 15, 2018 · US
Fluxing systems, bonding machines including fluxing systems, and methods of operating the same
US-2018117695-A1 · May 3, 2018 · US
High performance transient uniform cooling solution for thermal compression bonding process
US-9943931-B2 · Apr 17, 2018 · US
Method and device for cooling soldered printed circuit boards
US-9936569-B2 · Apr 3, 2018 · US
Atomization mechanism for cooling a bond head
US-2018068973-A1 · Mar 8, 2018 · US
Device, method, and system for cooling a flat object in a nonhomogeneous manner
US-2018050406-A1 · Feb 22, 2018 · US
Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same
US-9847314-B2 · Dec 19, 2017 · US
Protective gas mouthpiece, connection device and connection method
US-2017326675-A1 · Nov 16, 2017 · US
Methods of fabricating low melting point solder reinforced sealant and structures formed thereby
US-9808875-B2 · Nov 7, 2017 · US
Electronic apparatus and method for fabricating the same
US-9812418-B2 · Nov 7, 2017 · US
Electronic apparatus and method for fabricating the same
US-9761552-B2 · Sep 12, 2017 · US
Thermal compression bonding process cooling manifold
US-9748199-B2 · Aug 29, 2017 · US
Soldering jig for double-faced cooling power module
US-2017216948-A1 · Aug 3, 2017 · US
Heating and cooling device
US-2017203377-A1 · Jul 20, 2017 · US
Wire splicing device, wire splicing method, and method for manufacturing splice structure
US-9685769-B2 · Jun 20, 2017 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B23K3/085?
- CPC B23K3/085 is the Cooperative Patent Classification code for “Cooling, heat sink or heat shielding means.”
- How many patents are filed under CPC B23K3/085 (Cooling, heat sink or heat shielding means)?
- Our database includes 143 publications tagged with this CPC code.
- Is patent activity under CPC B23K3/085 growing?
- Publication counts under this code: 7 in 2024 vs 18 in 2025 (latest complete years).