Bond heads for thermocompression bonders, thermocompression bonders, and methods of operating the same

Patent metadata

Field	Value
Publication number	US-9847314-B2
Application number	US-201615217389-A
Country	US
Kind code	B2
Filing date	Jul 22, 2016
Priority date	Jul 2, 2013
Publication date	Dec 19, 2017
Grant date	Dec 19, 2017

Abstract

A bond head for a thermocompression bonder is provided. The bond head includes a tool configured to hold a workpiece to be bonded, a heater configured to heat the workpiece to be bonded, and a chamber proximate the heater. The chamber is configured to receive a cooling fluid for cooling the heater.

First claim

What is claimed is:

1. A method of thermocompressively bonding a workpiece to a substrate, the method comprising the steps of:
(a) bonding a workpiece to a substrate using a bond head of a thermocompression bonder, the bond head including a heater; and
(b) providing a cooling fluid into a chamber of the bond head proximate the heater to reduce a temperature of the heater after step (a),
wherein the chamber is adapted to move within a cavity defined by the bond head between a first position in contact with the heater and a second position out of contact with the heater.

2. The method of claim 1 further including the step of providing the chamber in contact with the heater during step (a).

3. The method of claim 1 further including the step of applying a force between the chamber and the heater during steps (a) and (b).

4. The method of claim 3 wherein the force applied during step (b) is different from the force applied during step (a).

5. The method of claim 1 wherein a heat exchange takes place between the heater and the chamber during step (b).

6. The method of claim 1 wherein the cooling fluid is provided into the chamber at step (b) and a second fluid is provided into the chamber after step (b).

7. The method of claim 6 wherein a liquid is provided as the cooling fluid into the chamber in step (b), and a gas is provided into the chamber after step (b).

8. The method of claim 1 further including a step of disposing at least two flexures between a support structure of the bond head and the heater.

9. The method of claim 8 wherein the at least two flexures each are anisotropically flexible.

10. The method of claim 8 wherein each of the at least two flexures are anisotropically flexible such that each of the flexures are compliant along a line that is substantially parallel to a holding surface of the tool, and in a direction from a center of the holding surface of the tool outwards toward the respective flexure.

11. The method of claim 8 wherein each of the at least two flexures are most flexible along a respective line originating in a center of the heater and extending toward the respective flexure.

12. A method of thermocompressively bonding a workpiece to a substrate, the method comprising the steps of:
(a) bonding a workpiece to a substrate using a bond head of a thermocompression bonder, the bond head including (i) a theta Z-drive mechanism, (ii) a lower bond head, and (iii) a tilt head control mechanism positioned between the theta Z-drive mechanism and the lower bond head, the lower bond head including a heater; and
(b) providing a cooling fluid into a chamber of the lower bond head proximate the heater to reduce a temperature of the heater after step (a).

13. The method of claim 12 further including the step of providing the chamber in contact with the heater during step (a).

14. The method of claim 12 further including the step of applying a force between the chamber and the heater during steps (a) and (b).

15. The method of claim 14 wherein the force applied during step (b) is different from the force applied during step (a).

16. The method of claim 12 wherein a heat exchange takes place between the heater and the chamber during step (b).

17. The method of claim 12 wherein the cooling fluid is provided into the chamber at step (b) and a second fluid is provided into the chamber after step (b).

18. The method of claim 17 wherein a liquid is provided as the cooling fluid into the chamber in step (b), and a gas is provided into the chamber after step (b).

19. The method of claim 12 further including a step of disposing at least two flexures between a support structure of the bond head and the heater.

20. The method of claim 19 wherein the at least two flexures each are anisotropically flexible.

21. The method of claim 19 wherein each of the at least two flexures are anisotropically flexible such that each of the flexures are compliant along a line that is substantially parallel to a holding surface of the tool, and in a direction from a center of the holding surface of the tool outwards toward the respective flexure.

22. The method of claim 19 wherein each of the at least two flexures are most flexible along a respective line originating in a center of the heater and extending toward the respective flexure.

Assignees

• Kulicke & Soffa Ind Inc

Inventors

• Wasserman Matthew B
• Schmidt-Lange Michael P

Classifications

• H10W72/07232

  Compression bonding, e.g. thermocompression bonding · CPC title

• H10W72/07173

  Means for moving chips, wafers or other parts, e.g. conveyor belts · CPC title

• H10W72/07152

  Means for cooling · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W99/00

  Subject matter not provided for in other groups of this subclass · CPC title