Method and device for cooling soldered printed circuit boards

Patent metadata

Field	Value
Publication number	US-9936569-B2
Application number	US-201214354296-A
Country	US
Kind code	B2
Filing date	Oct 22, 2012
Priority date	Oct 25, 2011
Publication date	Apr 3, 2018
Grant date	Apr 3, 2018

Abstract

Method for cooling soldered printed circuit board modules in a cooling zone of a soldering system, wherein at least one cooling gas comprising inert gas is introduced into the cooling zone, wherein the printed circuit boards are conveyed continuously from a soldering zone of the soldering system into the cooling zone, wherein the cooling gas is generated using liquid cooling gas. The method according to the invention and the device ( 1 ) according to the invention advantageously permit highly efficient cooling of printed circuit board modules after the soldering process. The cooling gas may advantageously be used for inerting the soldering system ( 2 ) after extraction from the cooling zone ( 15 ).

First claim

The invention claimed is:

1. A method for cooling soldered printed circuit board modules in a cooling zone of a soldering system, comprising:
introducing at least one cooling gas comprising inert gas into the cooling zone, conveying the printed circuit boards continuously from a soldering zone of the soldering system into the cooling zone, wherein the cooling gas is passed through a heat sink which is assigned to the cooling zone, and is generated using liquid cooling gas wherein at least one of the following temperatures:
the temperature in the cooling atmosphere,
the temperature of the cooling gas vaporized in the heat sink and emerging from the latter,
the temperature of the cooling gas during delivery into the cooling zone; and
the temperature of the cooling gas during delivery into the heat sink, is used as a controlled variable for at least one of the following quantities:
the volume flow rate of the cooling gas to be delivered into the cooling zone;
the volume flow rate of cooling gas into the heat sink;
the quantity fraction of liquid inert gas to be added when mixing the cooling gas; and
the quantity fraction of gaseous inert gas to be added when mixing the cooling gas.

2. The method according to claim 1 , wherein the liquid cooling gas is introduced into the cooling zone.

3. The method according to claim 1 , wherein the cooling gas is obtained by mixing the gaseous and liquid inert gas.

4. The method according to claim 1 , wherein the cooling gas is introduced into a cooling atmosphere of the cooling zone.

5. The method according to claim 1 , wherein the cooling gas is introduced at a predeterminable temperature.

6. The method according to claim 1 , wherein the cooling atmosphere cooled by the heat sink is circulated in the cooling zone.

7. The method according to claim 1 , wherein the printed circuit board modules are conveyed above and/or below the heat sink/heat sinks.

8. The method according to claim 1 , wherein at least one of the following elements: at least one fan is being assigned to a specific area of the cooling zone and at least one heat sink to cool the cooling atmosphere provided to the cooling zone are controlled to provide a cooling atmosphere in the cooling zone with a predetermined temperature gradient.

9. The method according to claim 1 , wherein the cooling gas, after at least one of the following flow paths:
after flowing through the cooling zone and
after flowing through the at least one heat sink,

is fed to at least one of the following zones as inert gas:
a soldering zone, in which a soldering process is carried out on the printed circuit board modules; and
a preheating zone, in which the printed circuit board modules are preheated before reaching the soldering zone.

10. The method according to claim 1 , wherein at least one of the following gases is used as the inert gas:
nitrogen;
argon;
helium and
carbon dioxide.

Assignees

• Air Liquide
• Lair Liquide Soci§Te Anonyme Pour Letude Et Lexploitation Des Procedes Georges Claude

Inventors

• Liebert Holger
• Ridgeway Patrick
• Kast Andre
• Coudurier Laurent

Classifications

• B23K1/008

  Soldering within a furnace (B23K1/012 takes precedence) · CPC title

• H05K1/0203 Primary

  Cooling of mounted components (H05K1/0272 takes precedence) · CPC title

• B23K1/0016 Primary

  Soldering of electronic components · CPC title

• B23K3/085

  Cooling, heat sink or heat shielding means · CPC title