Electronic apparatus and method for fabricating the same

Patent metadata

Field	Value
Publication number	US-9761552-B2
Application number	US-201615271744-A
Country	US
Kind code	B2
Filing date	Sep 21, 2016
Priority date	Dec 9, 2013
Publication date	Sep 12, 2017
Grant date	Sep 12, 2017

Abstract

An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.

First claim

What is claimed is:

1. An electronic apparatus fabrication method comprising:
preparing a first electronic part with a first terminal;
preparing a second electronic part with a second terminal; and
making the first terminal and the second terminal opposite to each other and joining the first terminal and the second terminal by the use of a joining material,
the joining the first terminal and the second terminal by the use of the joining material including:
heating and melting the joining material; and
cooling and solidifying the joining material, wherein temperature of the first electronic part is made higher than temperature of the second electronic part during the cooling and solidifying.

2. The electronic apparatus fabrication method according to claim 1 further comprising disposing over the first electronic part a first member having first heat capacity after the preparing the first electronic part with the first terminal, wherein the joining the first terminal and the second terminal by the use of the joining material includes joining the first terminal of the first electronic part over which the first member is disposed and the second terminal of the second electronic part.

3. The electronic apparatus fabrication method according to claim 2 further comprising removing the first member after the joining the first terminal and the second terminal by the use of the joining material.

4. The electronic apparatus fabrication method according to claim 3 , wherein:
the disposing the first member over the first electronic part includes attaching the first member to the first electronic part by the use of an adhesive; and
the removing the first member includes weakening adhesion of the adhesive and removing the first member from the first electronic part.

5. The electronic apparatus fabrication method according to claim 1 , wherein the cooling and solidifying the joining material includes selectively cooling the second electronic part, of the first electronic part and the second electronic part, so as to make the temperature of the first electronic part higher than the temperature of the second electronic part.

6. The electronic apparatus fabrication method according to claim 1 , wherein the cooling and solidifying the joining material includes selectively heating the first electronic part, of the first electronic part and the second electronic part, so as to make the temperature of the first electronic part higher than the temperature of the second electronic part.

Assignees

• Fujitsu Ltd

Inventors

• Shimizu Kozo
• Sakuyama Seiki

Classifications

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W76/17

  characterised by their materials · CPC title

• H10W76/67

  characterised by their materials · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W72/07152

  Means for cooling · CPC title