Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
Electronic apparatus and method for fabricating the same
US9812418B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9812418-B2 |
| Application number | US-201615351992-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 15, 2016 |
| Priority date | Dec 9, 2013 |
| Publication date | Nov 7, 2017 |
| Grant date | Nov 7, 2017 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joining portion contains the pole-like compound, so the strength of the joining portion is improved. When the first terminal and the second terminal are joined, the temperature of one of the first electronic part and the second electronic part is made higher than that of the other. A joining material is cooled and solidified in this state. By doing so, the pole-like compound is formed.
First claim
Opening claim text (preview).
What is claimed is: 1. An electronic apparatus comprising: a first electronic part with a first terminal; a second electronic part with a second terminal opposite the first terminal; and a joining portion that joins the first terminal and the second terminal, wherein the joining portion includes a portion containing at least a first metallic element and a second metallic element different from the first metallic element, and an intermetallic compound containing the first metallic element and the second metallic element different from the first metallic element, the intermetallic compound extending in a direction in which the first terminal and the second terminal are opposite to each other, the portion being around the intermetallic compound, and wherein the first metallic element is Sn, and the second metallic element is one of Au, Cu, Ni, and Pd. 2. The electronic apparatus according to claim 1 , wherein the intermetallic compound is pole-shaped.
Assignees
Inventors
Classifications
Encapsulations, e.g. protective coatings · CPC title
characterised by their materials · CPC title
characterised by their materials · CPC title
Die-attach connectors and bond wires · CPC title
Means for cooling · CPC title
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Frequently asked questions
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- What does patent US9812418B2 cover?
- An electronic apparatus includes a first electronic part with a first terminal, a second electronic part with a second terminal opposite the first terminal, and a joining portion which joins the first terminal and the second terminal. The joining portion contains a pole-like compound extending in a direction in which the first terminal and the second terminal are opposite to each other. The joi…
- Who is the assignee on this patent?
- Fujitsu Ltd
- What technology area does this patent fall under?
- Primary CPC classification H10W72/20. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Nov 07 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).