Reduced expansion thermal compression bonding process bond head
US-2015171047-A1 · Jun 18, 2015 · US
High performance transient uniform cooling solution for thermal compression bonding process
US9943931B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9943931-B2 |
| Application number | US-201615221102-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 27, 2016 |
| Priority date | Dec 20, 2011 |
| Publication date | Apr 17, 2018 |
| Grant date | Apr 17, 2018 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and the micro channels are coupled within the same block.
First claim
Opening claim text (preview).
What is claimed is: 1. An assembly comprising: a cooling block comprising an array of vertical micro channel jets coupled to a heater surface, wherein an outlet micro channel jet of the array is coupled with an adjacent inlet micro channel jet of the array; and an inlet and outlet manifold coupled to the array of vertical micro channel jets, wherein the heater surface and the array of vertical micro channel jets are coupled in the same block material, wherein the heater surface comprises a plurality of micro fins, and wherein a tip of each micro fin is aligned in a center position between adjacent inlet and outlet micro channel jets. 2. The assembly of claim 1 , wherein each outlet micro channel jet is coupled with two adjacent micro channel jets. 3. The assembly of claim 1 , wherein inlet and outlet micro channel jets are disposed in a staggered configuration. 4. The assembly of claim 1 , wherein a bottom portion of each inlet and outlet micro channel jet is chamfered. 5. The assembly of claim 1 , wherein the vertical micro channel jets comprise vertical individual inlet and outlet nozzles attached to the heater surface. 6. The assembly of claim 1 , further comprises a nozzle coupled to the heater, and a die coupled to the nozzle, wherein the die is on a substrate disposed on a pedestal. 7. The assembly of claim 5 , wherein the assembly comprises a portion of a TCB bonding system. 8. The assembly of claim 1 , wherein a TEC pad is disposed between the heater surface and the cooling block of the assembly.
Assignees
Inventors
Classifications
Compression bonding, e.g. thermocompression bonding · CPC title
Compression bonding, e.g. thermocompression bonding · CPC title
Means for cooling · CPC title
Means for applying energy, e.g. ovens or lasers · CPC title
comprising metals or metalloids, e.g. solders · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US9943931B2 cover?
- Various embodiments of thermal compression bonding transient cooling solutions are described. Those embodiments include a an array of vertically separated micro channels coupled to a heater surface, wherein every outlet micro channel comprises two adjacent inlet micro channel, and wherein an inlet and outlet manifold are coupled to the array of micro channels, and wherein the heater surface and…
- Who is the assignee on this patent?
- Intel Corp
- What technology area does this patent fall under?
- Primary CPC classification B23K37/003. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Apr 17 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).