Wire splicing device, wire splicing method, and method for manufacturing splice structure

Patent metadata

Field	Value
Publication number	US-10014671-B2
Application number	US-201715399995-A
Country	US
Kind code	B2
Filing date	Jan 6, 2017
Priority date	May 28, 2013
Publication date	Jul 3, 2018
Grant date	Jul 3, 2018

Abstract

A wire splicing method including: disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other; disposing solder to straddle the first wire and the second wire; disposing a connection wire on the solder; pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder; keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

First claim

The invention claimed is:

1. A wire splicing method comprising:
disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other;
disposing solder to straddle the first wire and the second wire;
disposing a connection wire on the solder;
pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder;
keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate;
separating the heating body from the pressing plate; and
cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

2. The wire splicing method according to claim 1 , wherein
the first wire, the second wire, and the connection wire are superconducting wires.

3. A method for manufacturing a splice structure comprising:
disposing a tape-like first wire and a tape-like second wire in a holding base so that an end portion of the first wire and an end portion of the second wire face each other;
disposing solder to straddle the first wire and the second wire;
disposing a connection wire on the solder;
pressing a heating body to the first wire, the second wire, and the connection wire via a pressing plate, and pressing together and heating the first wire, the second wire, and the connection wire so as to melt the solder;
keeping the first wire, the second wire, and the connection wire pressed together by the pressing plate,
separating the heating body from the pressing plate; and
cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.

4. The method for manufacturing a splice structure according to claim 3 , wherein the first wire, the second wire, and the connection wire are superconducting wires.

5. The wire connection method according to claim 1 , wherein
the first wire and the second wire are superconducting wires.

6. The method for manufacturing a connection structure according to claim 3 , wherein the first wire and the second wire are superconducting wires.

Assignees

• Fujikura Ltd

Inventors

• Fujita Shinji

Classifications

• B23K3/04

  Heating appliances · CPC title

• H01B12/00

  Superconductive or hyperconductive conductors, cables, or transmission lines · CPC title

• H02G1/005 Primary

  for cutting cables or wires, or splicing · CPC title

• B23K1/19

  taking account of the properties of the materials to be soldered · CPC title

• H01R43/02

  for soldered or welded connections · CPC title