Thermal compression bonding process cooling manifold

Patent metadata

Field	Value
Publication number	US-9748199-B2
Application number	US-201615062298-A
Country	US
Kind code	B2
Filing date	Mar 7, 2016
Priority date	Dec 18, 2013
Publication date	Aug 29, 2017
Grant date	Aug 29, 2017

Abstract

Embodiments of a thermal compression bonding (TCB) process cooling manifold, a TCB process system, and a method for TCB using the cooling manifold are disclosed. In some embodiments, the cooling manifold comprises a pre-mixing chamber that is separated from a mixing chamber by a baffle. The baffle may comprise at least one concentric pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is substantially evenly distributed to the mixing chamber. The pre-mixing chamber may be coupled to a source of primary cooling fluid. The mixing chamber may have an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid.

First claim

What is claimed is:

1. A method for thermal compression bonding, the method comprising:
generating a heat high enough to melt solder of one of a first die or a first substrate;
compressing the first die or the first substrate to one of a second die or a second substrate; and
cooling the solder with a cooling manifold having a pre-mixing chamber that is separated from a mixing chamber by a baffle wherein the baffle comprises a plurality of concentric patterns through a thickness of the baffle such that a primary cooling fluid from the pre-mixing chamber is substantially evenly distributed into the mixing chamber.

2. The method of claim 1 further comprising forming the cooling manifold by three-dimensional printing.

3. The method of claim 1 further comprising coupling a plurality of cooling fluid inputs to the cooling manifold.

4. The method of claim 3 further comprising:
coupling a plurality of cooling fluid outputs to a cooling block that is coupled to the mixing chamber of the cooling manifold;
causing the primary cooling fluid to enter the cooling manifold through the pre-mixing chamber;
causing the primary cooling fluid to enter the mixing chamber through the baffle; and
causing the primary cooling fluid to flow through a channel between the heater and the cooling block and exit the cooling block.

5. The method of claim 4 further comprising introducing a secondary cooling fluid into the cooling manifold.

6. The method of claim 4 , wherein the primary cooling fluid comprises one of air, gaseous helium, liquid helium, gaseous carbon dioxide, liquid carbon dioxide, compressed air, compressed helium, or compressed carbon dioxide.

7. The method of claim 4 , further comprising providing a vacuum source coupled to the cooling block for creating a vacuum force.

8. The method of claim 1 , further comprising conducting the primary cooling fluid from a plurality of cooling fluid out ports and away from the cooling block.

9. A method for thermal compression bonding, the method comprising:
melting solder of at least one of a first die or a first substrate;
attaching the at least one of the first die or the first substrate to at least one of a second die or a second substrate; and
cooling the solder with a cooling manifold having a pre-mixing chamber coupled to a source of primary cooling fluid, a mixing chamber having an input configured to accept the primary cooling fluid and an output to output the primary cooling fluid, a baffle coupled between the pre-mixing chamber and the mixing chamber, the baffle comprising at least one pattern formed through the baffle such that the primary cooling fluid in the pre-mixing chamber is distributed to the mixing chamber, and a secondary cooling fluid input coupled to a secondary cooling fluid output through channels in the cooling manifold such that a secondary cooling fluid is conducted through the channels from the secondary cooling fluid input to the secondary cooling fluid output.

10. The method of claim 9 , wherein melting the solder comprises:
attaching the at least one of the first die or the first substrate to a nozzle of the cooling manifold using a vacuum force; and
increasing a temperature of a heater coupled to the nozzle.

11. The method of claim 10 , further comprising holding the nozzle to the heater with vacuum force.

12. The method of claim 10 , further comprising increasing the temperature of the heater in response to a current applied to the heater.

13. The method of claim 10 , further comprising distributing the vacuum force over the nozzle through grooves in the nozzle.

14. The method of claim 9 , wherein the primary cooling fluid is forced into the pre-mixing chamber under pressure.

15. The method of claim 14 , further comprising the pressure forcing the primary cooling fluid through concentric patterns of the baffle that are exposed to the mixing chamber.

16. The method of claim 15 , further comprising mixing a plurality of cooling fluids in the source for the primary cooling fluid prior to forcing the primary cooling fluid into the pre-mixing chamber.

Assignees

• Intel Corp

Inventors

• Dhavaleswarapu Hemanth
• Li Zhihua
• Petrini Joseph
• Roach Steven B
• Devasenathipathy Shankar
• Kostiew George
• Eitan Amram

Classifications

• H10W72/07152

  Means for cooling · CPC title

• H10W72/07141

  Means for applying energy, e.g. ovens or lasers · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• H10W72/07236

  Soldering or alloying · CPC title