Connecting structure of oxide superconducting wire and method of manufacturing the same
US-2017288323-A1 · Oct 5, 2017 · US
Wire splicing device, wire splicing method, and method for manufacturing splice structure
US10044176B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10044176-B2 |
| Application number | US-201715399951-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jan 6, 2017 |
| Priority date | May 28, 2013 |
| Publication date | Aug 7, 2018 |
| Grant date | Aug 7, 2018 |
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- Title
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Abstract
Official abstract text for this publication.
A wire splicing method including: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together.
First claim
Opening claim text (preview).
The invention claimed is: 1. A wire splicing method comprising: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate; separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together. 2. The wire splicing method according to claim 1 , wherein the first wire and the second wire are superconducting wires. 3. A method for manufacturing a splice structure comprising: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween; pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping the first wire and the second wire pressed together by the pressing plate, separating the heating body from the pressing plate; and cooling the pressing plate to solidify the solder, and thereby connecting the first wire and the second wire together. 4. The method for manufacturing a splice structure according to claim 3 , wherein the first wire and the second wire are superconducting wires.
Assignees
Inventors
Classifications
- B23K3/087Primary
Soldering or brazing jigs, fixtures or clamping means · CPC title
for planar work · CPC title
Soldering of electronic components · CPC title
comprising means for positioning or holding the parts to be soldered or welded · CPC title
- H02G1/005Primary
for cutting cables or wires, or splicing · CPC title
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- What does patent US10044176B2 cover?
- A wire splicing method including: disposing an end portion of a tape-like first wire and an end portion of a tape-like second wire in a holding base in an overlapping manner with solder interposed therebetween, pressing a heating body to the first wire and the second wire via a pressing plate, and pressing together and heating the first wire and the second wire so as to melt the solder; keeping…
- Who is the assignee on this patent?
- Fujikura Ltd
- What technology area does this patent fall under?
- Primary CPC classification B23K3/087. Mapped technology areas include Operations & Transport.
- When was this patent published?
- Publication date Tue Aug 07 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).