Viscous fluid coating device

Patent metadata

Field	Value
Publication number	US-9969023-B2
Application number	US-201415122113-A
Country	US
Kind code	B2
Filing date	Feb 28, 2014
Priority date	Feb 28, 2014
Publication date	May 15, 2018
Grant date	May 15, 2018

Abstract

Solder housed in flow tank 20 is ejected from nozzle 22 by a pump provided inside flow tank 20 . Jet motor 26 that drives the pump is provided outside flow tank 20 , and cooling device 30 is provided between flow tank 20 and jet motor 26 . Cooling device 30 includes cooling pipe 52 that is formed folded back on itself. Nitrogen gas is supplied from an upper end of cooling pipe 52 , flows along cooling pipe 52 , and flows out of a lower end of cooling pipe 52 so as to be supplied to flow tank 20 . The temperature of the nitrogen gas increases due to heat dissipated from jet motor 26 , thus lowering the temperature of jet motor 26 . Heat is transferred from jet motor 26 to the nitrogen gas, and jet motor 26 is cooled satisfactorily.

First claim

The invention claimed is:

1. A viscous fluid coating device comprising:
a flow tank that houses a viscous fluid in a molten state;
a pump, operation of which ejects viscous fluid from the flow tank such that viscous fluid is coated on a circuit board;
a jet motor, provided outside the flow tank, that drives the pump; and
a cooling device provided outside the flow tank and including a passage through which cooling fluid is to flow, the cooling device located adjacent the jet motor to cool the jet motor using the cooling fluid,
wherein a downstream end of the passage is connected to the flow tank such that the cooling fluid is provided to the flow tank after cooling the jet motor.

2. The viscous fluid coating device according to claim 1 , wherein at least a portion of the passage is provided between the flow tank and the jet motor.

3. The viscous fluid coating device according to claim 1 , wherein
the passage includes multiple curved sections, and
the cooling device includes a heat exchange section provided with the passage formed from the multiple curved sections.

4. The viscous fluid coating device according to claim 1 , wherein the viscous fluid is solder, and the cooling fluid is an antioxidation gas to prevent oxidation of the solder.

5. A viscous fluid coating device comprising:
a flow tank that houses a viscous fluid in a molten state;
a pump, operation of which ejects viscous fluid from the flow tank such that viscous fluid is coated on a circuit board;
a jet motor, provided outside the flow tank, that drives the pump; and
a cooling device, provided outside the flow tank and including a passage through which cooling fluid is to flow, the cooling device located adjacent the jet motor to cool the jet motor using the cooling fluid,
wherein an upstream end of the passage is connected to a cooling fluid tank, and
wherein the cooling fluid is provided to the flow tank after cooling the jet motor.

6. The viscous fluid coating device according to claim 5 , wherein at least a portion of the passage is provided between the flow tank and the jet motor.

7. The viscous fluid coating device according to claim 5 , wherein
the passage includes multiple curved sections, and
the cooling device includes a heat exchange section provided with the passage formed from the multiple curved sections.

8. The viscous fluid coating device according to claim 5 , wherein the viscous fluid is solder, and the cooling fluid is an antioxidation gas to prevent oxidation of the solder.

9. The viscous fluid coating device according to claim 1 , wherein the flow tank includes an ejection nozzle to eject the viscous fluid, and the cooling fluid is ejected to contact the viscous fluid returning to the flow tank.

10. The viscous fluid coating device according to claim 5 , wherein the flow tank includes an ejection nozzle to eject the viscous fluid, and the cooling fluid is ejected to contact the viscous fluid returning to the flow tank.

Assignees

• Fuji Machine Mfg

Inventors

• Ishikawa Nobuyuki
• Tanaka Katsunori
• Nishibori Mitsuhiro

Classifications

• B23K1/08

  Soldering by means of dipping in molten solder · CPC title

• B23K1/0016

  Soldering of electronic components · CPC title

• B23K3/085

  Cooling, heat sink or heat shielding means · CPC title

• B23K3/0638 Primary

  for viscous material feeding, e.g. solder paste feeding (B23K3/0623 takes precedence) · CPC title

• B23K2201/42

  Operations & Transport · mapped topic