Transferring unit, substrate treating apparatus including the same, and substrate treating method

Patent metadata

Field	Value
Publication number	US-12004268-B2
Application number	US-202017091054-A
Country	US
Kind code	B2
Filing date	Nov 6, 2020
Priority date	Nov 7, 2019
Publication date	Jun 4, 2024
Grant date	Jun 4, 2024

Abstract

A transferring unit, a substrate treating apparatus including the same, and a substrate treating method are provided. The substrate treating apparatus includes a support plate, a plurality of protrusions protruding upward from the support plate to support a substrate, a temperature adjusting member provided in the support plate to heat or cool the substrate, and an ultrasound applying member to apply an ultrasound between the substrate placed on the plurality of protrusions and the support plate.

First claim

What is claimed is:

1. A substrate treating apparatus comprising:
a support plate;
a plurality of protrusions protruding upward from the support plate to support a substrate;
a temperature adjusting member provided in the support plate to heat or cool the substrate; and
an ultrasound applying member configured to apply an ultrasound between the substrate placed on the plurality of protrusions and the support plate,
wherein the ultrasound applying member applies the ultrasound in a direction parallel to the substrate.

2. The substrate treating apparatus of claim 1 , wherein the temperature adjusting member is a cooling member configured to cool the substrate.

3. The substrate treating apparatus of claim 2 , wherein the temperature adjusting member has a cooling fluid passage provided in the support plate.

4. The substrate treating apparatus of claim 1 , wherein the temperature adjusting member is a heating member configured to heat the substrate.

5. The substrate treating apparatus of claim 1 , wherein the ultrasound applying member is provided at one side portion of the support plate.

6. A substrate treating apparatus comprising:
a housing;
a heating unit including a heating plate positioned inside the housing to heat a substrate; and
a transferring unit positioned inside the housing to transfer the substrate from the heating plate,
wherein the transferring unit includes,
a transferring plate configured to place the substrate,
protrusions protruding upward from the transferring plate to support the substrate,
a cooling unit configured to cool the substrate which is heated, and
an ultrasound applying member configured to apply an ultrasound between the substrate and the transferring plate,
wherein the ultrasound applying member applies the ultrasound in a direction parallel to the substrate.

7. The substrate treating apparatus of claim 6 , wherein the cooling unit is provided in the transferring plate.

8. The substrate treating apparatus of claim 7 , wherein the cooling unit is a cooling fluid passage.

9. The substrate treating apparatus of claim 6 , further comprising:
a driver configured to drive the transferring plate,
wherein the ultrasound applying member is provided in the driver.

10. A transferring unit comprising:
a transferring plate configured to place a substrate;
protrusions protruding upward from the transferring plate to support the substrate;
a cooling unit provided in the transferring plate to cool the substrate which is heated; and
an ultrasound applying member configured to apply an ultrasound between the substrate and the transferring plate,
wherein the ultrasound applying member is provided to apply the ultrasound in a direction parallel to the substrate.

11. The transferring unit of claim 10 , wherein the cooling unit is provided in the transferring plate.

12. The transferring unit of claim 10 , wherein the cooling unit is a cooling fluid passage.

13. The transferring unit of claim 10 , further comprising:
a driver configured to drive the transferring plate,
wherein the ultrasound applying member is provided in the driver.

Assignees

• Semes Co Ltd

Inventors

• Lee Ji-Hwan

Classifications

• H10P72/0431 Primary

  Apparatus for thermal treatment · CPC title

• H10P72/3302

  Mechanical parts of transfer devices · CPC title

• H10P72/33

  into and out of processing chamber · CPC title

• H10P72/0434

  mainly by convection · CPC title

• H10P72/0602

  Temperature monitoring · CPC title