Substrate treating apparatus and substrate treating method

Patent metadata

Field	Value
Publication number	US-10274827-B2
Application number	US-201715622415-A
Country	US
Kind code	B2
Filing date	Jun 14, 2017
Priority date	Jun 24, 2016
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus comprises: a process chamber; a support member positioned in an inner space of the process chamber to support the substrate; an exhaust line provided to communicate with the interior of the process chamber; an exhaust member for providing a suction pressure to the exhaust line; and a controller for controlling the exhaust member when dividing the substrate treating step in which the treating for the substrate is performed into the first treating step and the second treating step, a difference is generated between the pressure that the exhaust member provides to the exhaust line in the first treating step and the pressure that the exhaust member provides to the exhaust line in the second treating step.

First claim

What is claimed is:

1. A substrate treating method comprising:
a carrying in step for carrying in a substrate into a process chamber;
a first treating step of placing the substrate on a upper surface of a support member located inside the process chamber and having a heater; and
a second treating step for heating the substrate placed on the upper surface of the support member in a state in which a main exhaust pressure larger than a pressure provided in an exhaust line connected to the process chamber in the first treating step is supplied to the exhaust line,
wherein a preparation pressure approximately equal to the pressure provided in the first treating step is supplied to the exhaust line in the carrying in step.

2. The method of claim 1 , wherein in the first treating step, an average value of the pressures provided to the exhaust line is smaller than the main exhaust pressure.

3. The method of claim 1 , wherein in the first treating step, a secondary exhaust pressure less than the main exhaust pressure in the exhaust line is provided.

4. The method of claim 1 , wherein the first treating step increases the pressure provided to the exhaust line after the exhaust line is started with a secondary exhaust pressure less than the main exhaust pressure being provided.

Assignees

• Semes Co Ltd

Inventors

• Lee Ki Seung
• Park Chang Uk

Classifications

• G03F7/0035

  Multiple processes, e.g. applying a further resist layer on an already in a previously step, processed pattern or textured surface · CPC title

• G03F7/168 Primary

  Finishing the coated layer, e.g. drying, baking, soaking · CPC title

• G03F7/16 Primary

  Coating processes; Apparatus therefor (applying coatings to base materials in general B05; applying photosensitive compositions to base for photographic purposes G03C1/74) · CPC title

• G03F7/30

  Imagewise removal using liquid means · CPC title

• H01L27/00

  Electricity · mapped topic