Rapid Thermal Processing System With Cooling System
US-2024379390-A1 · Nov 14, 2024 · US
Electricity
Electricity · Cooperative Patent Classification (CPC)
Electric circuits, power, telecommunications, and semiconductors.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | H10P72/0602 |
| Official title | — |
| Display label | Electricity (mapped technology topic) |
| Total patents | 5,421 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is stable.
| Year | Patents |
|---|---|
| 2015 | 179 |
| 2016 | 203 |
| 2017 | 283 |
| 2018 | 389 |
| 2019 | 534 |
| 2020 | 669 |
| 2021 | 626 |
| 2022 | 603 |
| 2023 | 592 |
| 2024 | 604 |
| 2025 | 612 |
| 2026 | 127 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Multifunctional wafer pretreatment chamber and chemical vapor deposition device
US-2024337011-A1 · Oct 10, 2024 · US
Diagnostic device, semiconductor manufacturing equipment system, semiconductor equipment manufacturing system, and diagnostic method
US-2024321608-A1 · Sep 26, 2024 · US
Substrate processing method and substrate processing system
US-2024173742-A1 · May 30, 2024 · US
Bonding method and bonding apparatus
US-11931995-B2 · Mar 19, 2024 · US
Bonding method, bonder, and bonding system
US-2024066624-A1 · Feb 29, 2024 · US
Substrate treating apparatus and substrate treating method
US-2024030057-A1 · Jan 25, 2024 · US
Substrate temperature measuring device, substrate processing apparatus including the same, and substrate temperature measuring method using the same
US-2024019311-A1 · Jan 18, 2024 · US
Ceramic heater
US-11874180-B2 · Jan 16, 2024 · US
Cassette housing, prober, server rack, and storage system
US-2024014061-A1 · Jan 11, 2024 · US
Multi zone heating and cooling esc for plasma process chamber
US-2015366004-A1 · Dec 17, 2015 · US
Stripping apparatus and method using the same to clean glass substrates
US-2015336137-A1 · Nov 26, 2015 · US
Processing systems and methods for halide scavenging
US-2015332930-A1 · Nov 19, 2015 · US
Dry non-plasma treatment system
US-2015314313-A1 · Nov 5, 2015 · US
Bonding method, bonding apparatus and bonding system
US-9165803-B2 · Oct 20, 2015 · US
Real-time calibration for wafer processing chamber lamp modules
US-9159597-B2 · Oct 13, 2015 · US
In situ substrate detection for a processing system using infrared detection
US-9151597-B2 · Oct 6, 2015 · US
Vapor phase growth apparatus and vapor phase growth method
US-2015279659-A1 · Oct 1, 2015 · US
Technique For Temperature Measurement And Calibration Of Semiconductor Workpieces Using Infrared
US-2015276487-A1 · Oct 1, 2015 · US
Conditioned semiconductor system parts
US-2015275361-A1 · Oct 1, 2015 · US
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Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC H10P72/0602?
- CPC H10P72/0602 is the Cooperative Patent Classification code for “Electricity.”
- How many patents are filed under CPC H10P72/0602 (Electricity)?
- Our database includes 5,421 publications tagged with this CPC code.
- Is patent activity under CPC H10P72/0602 growing?
- Publication counts under this code: 604 in 2024 vs 612 in 2025 (latest complete years).