Substrate support unit, heat treatment unit, and substrate treating apparatus including the same

Patent metadata

Field	Value
Publication number	US-10763152-B2
Application number	US-201715823311-A
Country	US
Kind code	B2
Filing date	Nov 27, 2017
Priority date	Nov 30, 2016
Publication date	Sep 1, 2020
Grant date	Sep 1, 2020

Abstract

Embodiments of the inventive concept relate to a substrate treating apparatus. A substrate support unit configured to support a substrate includes a support plate, on which the substrate is positioned, the support plate may include a passage formed on an upper surface of the support plate and connecting a central area and a side surface of the support plate, and a recess formed in a peripheral area of the support plate and recessed inwards from a side surface of the support plate, and the recess may communicate with one end of the passage.

First claim

What is claimed is:

1. A substrate support unit configured to support a substrate, the substrate support unit comprising:
a support plate, on which the substrate is positioned,
wherein the support plate includes:
a passage formed on a first surface of the support plate and connecting a central area and a side surface of the support plate; and
a recess formed in a peripheral area of the support plate and recessed inwards from the side surface of the support plate, and

wherein
the recess communicates with one end of the passage,
the passage is recessed from the first surface of the support plate towards a second surface opposite the first surface,
when viewed from the first surface, the width of the recess is larger than the width of the passage.

2. The substrate support unit of claim 1 ,
wherein the vertical length of the recess is larger than the depth of the passage.

3. The substrate support unit of claim 2 , wherein when viewed from the first surface, an inner end of the recess overlaps a peripheral area of the substrate positioned on the support plate.

4. The substrate support unit of claim 3 , wherein the substrate support unit further includes:
a plurality of lift pins that seats the substrate to the support plate and lifts the substrate from the support plate,
wherein the support plate has pin holes, through which the lift pins are elevated, and
wherein the passage connects the pin holes and the side surface of the support plate.

5. The substrate support unit of claim 4 , wherein the passage includes:
a first passage provided in a central area of the support plate in a ring shape; and
a second passage connecting the first passage and the recess, and
wherein when viewed from the first surface, the first passage overlaps the pin holes.

6. A substrate support unit configured to support a substrate, the substrate support unit comprising:
a support plate, on which the substrate is positioned,
wherein the support plate includes:
a passage formed on a first surface of the support plate and connecting a central area and a side surface of the support plate; and
a recess formed in a peripheral area of the support plate and recessed inwards from the side surface of the support plate, and
wherein the recess communicates with one end of the passage,
a side surface of the passage is inclined inwards as the passage extends from the first surface of the support plate to a second surface opposite the first surface.

7. The substrate support unit of claim 6 , wherein the passage has a trapezoidal shape comprising a first edge between the first and second surfaces and a second edge disposed on the first surface, the first edge of which is narrower than the second edge of the trapezoidal shape when viewed in a direction perpendicular to the length direction of the passage.

8. The substrate support unit of claim 6 , wherein the passage has a V shape when viewed in a direction perpendicular to the length direction of the passage.

9. A heating unit configured to heat a substrate, the heating unit comprising:
a housing configured to provide a space in the interior thereof;
a substrate support unit configured to support the substrate in the space and having a support plate, on which the substrate is positioned; and
a temperature adjusting member configured to adjust the temperature of the substrate supported by the support plate,
wherein the support plate includes:
a passage formed on a first surface of the support plate and connecting a central area and a side surface of the support plate; and
a recess formed in a peripheral area of the support plate and recessed inwards from the side surface of the support plate, and

wherein
the recess communicates with one end of the passage,
the passage is recessed from the first surface of the support plate towards a second surface opposite the first surface,
when viewed from the first surface, the width of the recess is larger than the width of the passage.

10. The heating unit of claim 9 ,
wherein the vertical length of the recess is larger than the depth of the passage.

11. The heating unit of claim 10 , wherein when viewed from the first surface, an inner end of the recess overlaps a peripheral area of the substrate positioned on the support plate.

12. The heating unit of claim 11 , wherein the substrate support unit further includes:
a plurality of lift pins that seats the substrate to the support plate and lifts the substrate from the support plate,
wherein the support plate has pin holes, through which the lift pins are elevated, and
wherein the passage connects the pin holes and the side surface of the support plate.

13. The heating unit of claim 12 , wherein the passage includes:
a first passage provided in a central area of the support plate in a ring shape; and
a second passage connecting the first passage and the recess, and
wherein when viewed from the first surface, the first passage overlaps the pin holes.

14. The heating unit of claim 10 , wherein a side surface of the passage is inclined inwards as the side surface of the passage extends from the first surface toward the second surface.

15. The heating unit of claim 14 , wherein the passage has a trapezoidal shape comprising a first edge between the first and second surfaces and a second edge disposed on the first surface, the first edge of which is narrower than the second edge of the trapezoidal shape when viewed in a direction perpendicular to the length direction of the passage.

16. The heating unit of claim 14 , wherein the passage has a V shape when viewed in a direction perpendicular to the length direction of the passage.

17. The heating unit of claim 10 , wherein the temperature adjusting unit includes:
a cooling member provided in the support plate and configured to cool the substrate supported by the support plate.

18. The heating unit of claim 17 , further comprising:
a buffer plate located on the support plate.

19. The heating unit of claim 10 , wherein the temperature adjusting unit further includes:
a heating member provided in the support plate and configured to heat the substrate supported by the support plate.

Assignees

• Semes Co Ltd

Inventors

• Jo Min Woo
• Choi Cheolmin
• Park Sanguk
• Kang Man Kyu

Classifications

• H10P72/7614

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

• H10P72/7612

  characterised by lifting arrangements, e.g. lift pins · CPC title

• H10P72/3404

  Storage means · CPC title

• H10P72/0458

  vertical arrangement · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title