Application log coding method and device and computer readable storage medium
US-12517863-B2 · Jan 6, 2026 · US
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Zhang Haiyang patents
Zhang Haiyang is listed as an inventor on 141 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Zhang Haiyang |
| Total patents | 141 |
| First publication | Jan 13, 2015 |
| Latest publication | Jan 6, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Electronic mechanical braking method and electronic mechanical braking apparatus
US-12497013-B2 · Dec 16, 2025 · US
Semiconductor structure and forming method thereof
US-12463049-B2 · Nov 4, 2025 · US
Signal decision equalization method and apparatus
US-12388686-B2 · Aug 12, 2025 · US
Semiconductor structure and method of forming semiconductor structure
US-12389673-B2 · Aug 12, 2025 · US
Location Detection Method and Related Apparatus
US-2025023763-A1 · Jan 16, 2025 · US
Application log coding method and device and computer readable storage medium
US-2024362181-A1 · Oct 31, 2024 · US
Electronic device
US-2024357756-A1 · Oct 24, 2024 · US
Semiconductor structure and fabrication method thereof
US-2024313078-A1 · Sep 19, 2024 · US
Semiconductor structure and method of forming semiconductor structure
US-2024128265-A1 · Apr 18, 2024 · US
Recent patents
Latest publications not already listed above.
Signal decision equalization method and apparatus
US-2024129168-A1 · Apr 18, 2024 · US
Semiconductor structure and forming method thereof
US-2024088243-A1 · Mar 14, 2024 · US
Semiconductor fabrication method and structure using multiple sacrificial layers to form sidewall spacers
US-11894231-B2 · Feb 6, 2024 · US
Transaction settlement method and apparatus
US-11887068-B2 · Jan 30, 2024 · US
Semiconductor structure and method of forming semiconductor structure
US-11881480-B2 · Jan 23, 2024 · US
Semiconductor structure and fabrication method thereof
US-2023411398-A1 · Dec 21, 2023 · US
Semiconductor structure and method for fabricating the same
US-11810966-B2 · Nov 7, 2023 · US
Semiconductor structure and fabrication method thereof
US-11756795-B2 · Sep 12, 2023 · US
Semiconductor device
US-11742427-B2 · Aug 29, 2023 · US
Electronic Mechanical Braking Method and Electronic Mechanical Braking Apparatus
US-2023249660-A1 · Aug 10, 2023 · US
Semiconductor structure and forming method thereof
US-2023238245-A1 · Jul 27, 2023 · US
Semiconductor device fabrication method
US-11710780-B2 · Jul 25, 2023 · US
Semiconductor structure and forming method thereof
US-2023223452-A1 · Jul 13, 2023 · US
Semiconductor structure and fabrication method thereof
US-11676865-B2 · Jun 13, 2023 · US
Semiconductor structure
US-2023154848-A1 · May 18, 2023 · US
Semiconductor structure and fabrication method thereof
US-11646315-B2 · May 9, 2023 · US
Semiconductor structure and fabrication method thereof
US-11600619-B2 · Mar 7, 2023 · US
Semiconductor structure and method for forming the same
US-11551924-B2 · Jan 10, 2023 · US
Optical system, electronic device, and display apparatus
US-2023003998-A1 · Jan 5, 2023 · US
Monitoring camera
US-D967886-S · Oct 25, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Semiconductor Mfg Int Shanghai Corp | 86 |
| Semiconductor Mfg Int Beijing Corp | 66 |
| Ca Inc | 20 |
| Semiconductor Mfg Int Shanghai | 13 |
| Huawei Tech Co Ltd | 8 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/038 | 70 |
| H10D84/0158 | 48 |
| H10D30/024 | 45 |
| H10D30/62 | 37 |
| H10D84/834 | 34 |