Acoustic micropump device using piezoelectric transducers to create a directional fluid flow
US-2025369434-A1 · Dec 4, 2025 · US
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Wu Chen patents
Wu Chen is listed as an inventor on 19 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Wu Chen |
| Total patents | 19 |
| First publication | Oct 29, 2020 |
| Latest publication | Dec 4, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor die containing silicon nitride stress compensating regions and method for making the same
US-11430745-B2 · Aug 30, 2022 · US
Bonded die assembly containing a manganese-containing oxide bonding layer and methods for making the same
US-11362079-B2 · Jun 14, 2022 · US
Embedded bonded assembly and method for making the same
US-11276705-B2 · Mar 15, 2022 · US
Bonding pads including interfacial electromigration barrier layers and methods of making the same
US-11270963-B2 · Mar 8, 2022 · US
Bonded assembly containing laterally bonded bonding pads and methods of forming the same
US-11239204-B2 · Feb 1, 2022 · US
Semiconductor die containing silicon nitride stress compensating regions and method for making the same
US-2021272912-A1 · Sep 2, 2021 · US
Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same
US-11094653-B2 · Aug 17, 2021 · US
Bonded assembly containing horizontal and vertical bonding interfaces and methods of forming the same
US-11088116-B2 · Aug 10, 2021 · US
Bonding pads including interfacial electromigration barrier layers and methods of making the same
US-2021217716-A1 · Jul 15, 2021 · US
Recent patents
Latest publications not already listed above.
Bonded die assembly containing partially filled through-substrate via structures and methods for making the same
US-11037908-B2 · Jun 15, 2021 · US
Bonded assembly containing horizontal and vertical bonding interfaces and methods of forming the same
US-2021159216-A1 · May 27, 2021 · US
Bonded assembly containing laterally bonded bonding pads and methods of forming the same
US-2021159215-A1 · May 27, 2021 · US
Bonded assembly containing a dielectric bonding pattern definition layer and methods of forming the same
US-2021143115-A1 · May 13, 2021 · US
Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the same
US-11004773-B2 · May 11, 2021 · US
Embedded bonded assembly and method for making the same
US-2021066317-A1 · Mar 4, 2021 · US
Bonded die assembly containing partially filled through-substrate via structures and methods for making the same
US-2021028148-A1 · Jan 28, 2021 · US
Bonded die assembly containing a manganese-containing oxide bonding layer and methods for making the same
US-2020395350-A1 · Dec 17, 2020 · US
Porous barrier layer for improving reliability of through-substrate via structures and methods of forming the same
US-2020343161-A1 · Oct 29, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Sandisk Technologies Llc | 18 |
| Imec Vzw | 1 |
| Univ Leuven Kath | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 18 |
| H10W90/792 | 16 |
| H10W80/00 | 14 |
| H10B43/40 | 14 |
| H01L25/50 | 14 |