Tin or tin alloy electroplating solution, method for forming bumps, and method for producing circuit board
US-2023038219-A1 · Feb 9, 2023 · US
Watanabe Mami is listed as an inventor on 16 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Watanabe Mami |
| Total patents | 16 |
| First publication | Oct 10, 2017 |
| Latest publication | Feb 9, 2023 |
Publications ranked by popularity score, then publication date.
US-2023038219-A1 · Feb 9, 2023 · US
US-2023027568-A1 · Jan 26, 2023 · US
US-11268203-B2 · Mar 8, 2022 · US
US-11174565-B2 · Nov 16, 2021 · US
US-11162182-B2 · Nov 2, 2021 · US
US-2021040636-A1 · Feb 11, 2021 · US
US-2020378024-A1 · Dec 3, 2020 · US
US-2020378025-A1 · Dec 3, 2020 · US
US-2020378023-A1 · Dec 3, 2020 · US
US-10450665-B2 · Oct 22, 2019 · US
Latest publications not already listed above.
US-10329680-B2 · Jun 25, 2019 · US
US-10174434-B2 · Jan 8, 2019 · US
US-2018057953-A1 · Mar 1, 2018 · US
US-2018051384-A1 · Feb 22, 2018 · US
US-2018051383-A1 · Feb 22, 2018 · US
US-9783904-B2 · Oct 10, 2017 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Mitsubishi Materials Corp | 16 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D3/60 | 14 |
| C25D3/32 | 14 |
| H05K3/188 | 11 |
| C25D7/123 | 9 |
| H05K3/4007 | 8 |