Plating solution using ammonium salt

Patent metadata

Field	Value
Publication number	US-2018057953-A1
Application number	US-201615560300-A
Country	US
Kind code	A1
Filing date	Mar 24, 2016
Priority date	Mar 26, 2015
Publication date	Mar 1, 2018
Grant date	—

Abstract

A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing a specific ammonium salt is provided.

First claim

1 . A plating solution comprising:
(A) a soluble salt containing at least a stannous salt; (B) an acid selected from organic acid and inorganic acid or a salt of the acid; and (C) an additive, wherein the additive comprises a ammonium salt represented by a general formula (1) below,

wherein, in the formula (1),
R 1 indicates C n H 2n+1 , n being an integer of 8 to 16,
R 2 and R 3 are identical or different, and indicate C n H 2n+1 , n being an integer of 1 to 2,
X represents a halogen, and
Y represents (CH 2 —CH 2 —O) n , n being an integer of 1 to 2.

2 . The plating solution according to claim 1 , wherein
the additive further comprises a nonionic surfactant represented by a general formula (2) below,
R 3 —Y 1 —Z—Y 2 —R 4   (2)

and wherein, in the formula (2), R 3 and R 4 is the group represented by the formula (A) below,
—(C n H 2n —O) m —H   (A)

and wherein, Y 1 and Y 2 represent a single bond or a group selected from —O—, —COO— and —CONH—; and Z represents a benzene ring or 2,2-diphenylpropane, and in the formula (A), n indicates 2 or 3 and m indicates an integer from 1 to 15.

3 . The plating solution according to claim 1 , further comprising an additional additive of a complexing agent, a brightener, or an antioxidant.

4 . The plating solution according to claim 2 , further comprising an additional additive of a complexing agent, a brightener, or an antioxidant.

Assignees

• Mitsubishi Materials Corp

Inventors

• Watanabe Mami
• Nakaya Kiyotaka

Classifications

• H10W72/01235

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• C25D3/60

  containing more than 50% by weight of tin · CPC title

• H05K3/188

  by direct electroplating · CPC title

• C25D3/32 Primary

  characterised by the organic bath constituents used · CPC title