Plating liquid

Patent metadata

Field	Value
Publication number	US-11174565-B2
Application number	US-201816497032-A
Country	US
Kind code	B2
Filing date	Mar 2, 2018
Priority date	Mar 27, 2017
Publication date	Nov 16, 2021
Grant date	Nov 16, 2021

Abstract

This plating liquid contains (A) a soluble salt that contains at least a stannous salt, (B) an acid selected from organic acids and inorganic acids or a salt thereof, and (C) two kinds of surfactants of an amine-based surfactant (C1) and a nonionic surfactant(s) (C2 and/or C3). The amine-based surfactant (C1) is a polyoxyethylene alkyl amine represented by general formula (1); and the nonionic surfactant(s) (C2 and/or C3) is a condensation product of a polyoxyethylene and a polyoxypropviene represented by general formula (2) or general formula (3). In formula (1), x is 12-18 and y is 4-12. In formula (2), m is 15-30 and (n1+n2) is 40-50. In formula (3), (m1+m2) is 15-30 and n is 40-50.

First claim

The invention claimed is:

1. A plating liquid comprising
(A) a soluble salt containing at least a stannous salt,
(B) an acid selected from organic acids and inorganic acids or a salt thereof, and
(C) an additive,

wherein
the additive contains two kinds of surfactants of an amine-based surfactant (C1) and a nonionic surfactant(s) (C2 and/or C3),
the amine-based surfactant (C1) is a polyoxyethylene alkylamine represented by the following general formula (1), and the nonionic surfactant (C2 or C3) is a condensation product of a polyoxyethylene and a polyoxypropylene represented by the following general formula (2) or general formula (3),

wherein, in the formula (1), x is 12 to 18 and y is 4 to 12,

wherein, in the formula (2), m is 15 to 30 and n1+n2 is 40 to 50,

wherein, in the formula (3), m1+m2 is 15 to 30 and n is 40 to 50.

2. The plating liquid according to claim 1 , wherein the additive further comprises two or more other additives among a surfactant other than the two kinds of the surfactants (C1, C2 and/or C3), a complexing agent, a glossing agent and an antioxidant.

3. The plating liquid according to claim 1 , wherein a content of the amine-based surfactant (C1) of the present invention in the plating liquid is 1 to 10 g/L.

4. The plating liquid according to claim 3 , wherein the content of the amine-based surfactant (C1) of the present invention in the plating liquid is 3 to 5 g/L.

5. The plating liquid according to claim 1 , wherein a content of the nonionic surfactant (C2 and/or C3) of the present invention in the plating liquid is 1 to 10 g/L.

6. The plating liquid according to claim 5 , wherein the content of the nonionic surfactant (C2 and/or C3) of the present invention in the plating liquid is 1 to 5 g/L.

7. The plating liquid according to claim 1 , wherein a content of both the surfactants of the amine-based surfactant (C1) and the nonionic surfactant (C2 and/or C3) in total in the plating liquid is 1 to 10 g/L.

8. The plating liquid according to claim 7 , wherein the content of both the surfactants of the amine-based surfactant (C1) and the nonionic surfactant (C2 and/or C3) in total in the plating liquid is 1 to 5 g/L.

9. The plating liquid according to claim 1 , wherein the acid or a salt thereof (B) is an organic sulfonic acid or a salt thereof.

10. The plating liquid according to claim 1 , wherein the acid or a salt thereof (B) is an alkane sulfonic acid, an alkanol sulfonic acid, an aromatic sulfonic acid, or an aliphatic carboxylic acid.

11. The plating liquid according to claim 1 , wherein the acid or a salt thereof (B) is an inorganic acid or a salt thereof.

12. The plating liquid according to claim 1 , wherein the acid or a salt thereof (B) is a fluoroboric acid, hydrofluorosilicic acid, sulfamic acid, hydrochloric acid, sulfuric acid, nitric acid, or perchloric acid.

13. The plating liquid according to claim 1 , wherein a content of the soluble metal salt (A) is 30 to 100 g/L.

14. The plating liquid according to claim 12 , wherein the content of the soluble metal salt (A) is 40 to 60 g/L.

15. The plating liquid according to claim 1 , wherein a content of the inorganic acid, the organic acid or a salt thereof (B) is 80 to 300 g/L.

16. The plating liquid according to claim 15 , wherein the content of the inorganic acid, the organic acid or a salt thereof (B) is 100 to 200 g/L.

Assignees

• Mitsubishi Materials Corp

Inventors

• Watanabe Mami
• Nakaya Kiyotaka
• Konno Yasushi

Classifications

• C25D7/12

  Semiconductors · CPC title

• C25D3/60

  containing more than 50% by weight of tin · CPC title

• C25D7/00

  Electroplating characterised by the article coated · CPC title

• C25D3/32 Primary

  characterised by the organic bath constituents used · CPC title