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US-2015382112-A1 · Dec 31, 2015 · US
Tin or tin-alloy plating liquid, bump forming method, and circuit board production method
US2021040636A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2021040636-A1 |
| Application number | US-201916979717-A |
| Country | US |
| Kind code | A1 |
| Filing date | Mar 19, 2019 |
| Priority date | Mar 20, 2018 |
| Publication date | Feb 11, 2021 |
| Grant date | — |
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- Title
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Abstract
Official abstract text for this publication.
This tin or tin-alloy plating liquid contains (A) a soluble salt including at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid, or a salt thereof; (C) a surfactant; (D) a leveling agent; and (E) an additive, wherein the surfactant is a compound (C1) represented by Formula (1) and/or a compound (C2) represented by Formula (2). In Formulas (1) and (2), R is an alkyl group having 7 to 13 carbon atoms, m is 5 to 11, n is 1 to 3, and m and n are different from each other.
First claim
Opening claim text (preview).
1 . A tin or tin-alloy plating liquid comprising: (A) a soluble salt including at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid, or a salt thereof; (C) a surfactant; (D) a leveling agent; and (E) an additive, wherein the surfactant is a compound (C1) represented by Formula (1) and/or a compound (C2) represented by Formula (2), in Formula (1), R is an alkyl group having 7 to 13 carbon atoms, m is 5 to 11, n is 0 to 3, and m and n are different from each other, and in Formula (2), R is an alkyl group having 7 to 13 carbon atoms, m is 5 to 11, n is 1 to 3, and m and n are different from each other. 2 . The tin or tin-alloy plating liquid according to claim 1 , wherein the additive contains two or more selected from a surfactant other than the two surfactants (C1 and C2), an antioxidant, and an alcohol having 1 to 3 carbon atoms. 3 . A method for forming bumps, the method comprising: a step of forming tin or tin-alloy plating deposition layers on a substrate using the tin or tin-alloy plating liquid according to claim 1 ; and a step of subsequently performing a reflow process to form bumps. 4 . A method for producing a circuit board, the method comprising: producing a circuit board using the bumps formed by the method according to claim 3 . 5 . A method for forming bumps, the method comprising: a step of forming tin or tin-alloy plating deposition layers on a substrate using the tin or tin-alloy plating liquid according to claim 2 ; and a step of subsequently performing a reflow process to form bumps. 6 . A method for producing a circuit board, the method comprising: producing a circuit board using the bumps formed by the method according to claim 5 .
Assignees
Inventors
Classifications
comprising metals or metalloids, e.g. PbSn, Ag or Cu · CPC title
Bond pads specially adapted therefor · CPC title
by reflowing · CPC title
by plating, e.g. electroless plating or electroplating · CPC title
comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title
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Frequently asked questions
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- What does patent US2021040636A1 cover?
- This tin or tin-alloy plating liquid contains (A) a soluble salt including at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid, or a salt thereof; (C) a surfactant; (D) a leveling agent; and (E) an additive, wherein the surfactant is a compound (C1) represented by Formula (1) and/or a compound (C2) represented by Formula (2). …
- Who is the assignee on this patent?
- Mitsubishi Materials Corp
- What technology area does this patent fall under?
- Primary CPC classification C25D5/505. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Thu Feb 11 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (A1). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).