Tin or tin alloy plating solution

Patent metadata

Field	Value
Publication number	US-2020378024-A1
Application number	US-201816757855-A
Country	US
Kind code	A1
Filing date	Oct 23, 2018
Priority date	Oct 24, 2017
Publication date	Dec 3, 2020
Grant date	—

Abstract

here, in the Formula (1), X is CaH2a (a is 1 or 3) and m is 2 to 12.

First claim

1 . A method of forming a tin or tin alloy plating deposition layer comprising the step of forming a tin or tin alloy plating deposition layer on a substrate with vias having multiple kinds of via diameters by using a tin or tin alloy plating solution,
wherein the tin or tin alloy plating solution comprises: (A) a soluble salt containing at least a stannous salt; (B) an acid selected from an organic acid and an inorganic acid or a salt thereof; (C) a surfactant; and (D) a leveling agent, wherein the surfactant contains a phenyl-based surfactant and the phenyl-based surfactant is a polyoxyethylene bisphenol ether represented by General Formula (1),

here, in the Formula (1), X is C a H 2a (a is 1 or 3) and m is 2 to 12,
the leveling agent is made of a first leveling agent and a second leveling agent
the first leveling agent is one or more selected from a group consisting of aliphatic aldehyde, aromatic aldehyde, aliphatic ketone and aromatic ketone, and
the second leveling agent is α,β-unsaturated carboxylic acid or α,β-unsaturated carboxylic acid amide, or a salt thereof.

2 . The method of forming a tin or tin alloy plating deposition layer according to claim 1 , wherein the tin or tin alloy plating solution further comprises: two or more of: a surfactant other than the phenyl-based surfactant; an antioxidant; and an alcohol having 1 to 3 carbon atoms.

3 . A method for forming a bump comprising the step of performing a reflow process on the tin or tin alloy plating deposition layer formed by the method of forming a tin or tin alloy plating deposition layer according to claim 1 .

4 . A method for producing a circuit board using a bump formed by the method according to claim 3 .

5 . A method for forming a bump comprising the step of performing a reflow process on the tin or tin alloy plating deposition layer formed by the method of forming a tin or tin alloy plating deposition layer according to claim 2 .

Assignees

• Mitsubishi Materials Corp

Inventors

• Watanabe Mami
• SUSUKI Kyoka
• Nakaya Kiyotaka

Classifications

• H10W72/227

  Multiple bumps having different sizes · CPC title

• H10W72/012

  of bump connectors, dummy bumps or thermal bumps · CPC title

• H05K3/346

  Solder materials or compositions specially adapted therefor · CPC title

• H05K3/34

  by soldering · CPC title

• C25D3/32 Primary

  characterised by the organic bath constituents used · CPC title