Plating solution using sulfonium salt

US10329680B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10329680-B2
Application numberUS-201615561155-A
CountryUS
Kind codeB2
Filing dateMar 24, 2016
Priority dateMar 26, 2015
Publication dateJun 25, 2019
Grant dateJun 25, 2019

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  1. Title

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  2. Abstract

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  5. First independent claim

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Abstract

Official abstract text for this publication.

A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing sulfonium salt with one or more of aromatic rings is provided.

First claim

Opening claim text (preview).

What is claimed is: 1. A plating solution for electrodeposition comprising: (A) a soluble salt containing at least a stannous salt in an amount of 30 to 100 g/L; (B) an acid selected from an organic acid and an inorganic acid, or a salt of the acid, in an amount of 80 to 300 g/L; and (C) an additive, wherein the additive comprises a sulfonium salt in an amount of 0.1 to 10 g/L, the sulfonium salt having one or more of aromatic rings represented by a general formula (1) below, wherein, R 1 and R 2 in the formula (1) are identical or different, and are any one of a phenyl group, a hydroxyphenyl group, a tolyl group, a hydrogen atom, C n H 2n+1 , n being an integer from 1 to 5, Ph represents a phenyl group, and X represents a halogen. 2. The plating solution according to claim 1 , wherein the additive further comprises a nonionic surfactant represented by a general formula (2) below, R 3 —Y 1 —Z-Y 2 —R 4   (2) and wherein, in the formula (2), R 3 and R 4 is represented by the formula (A) below, —(C n H 2n —O) m —H  (A) and wherein, Y 1 and Y 2 represent a single bond or a group selected from —O—, —COO— and —CONH—; and Z represents a benzene ring or 2,2-diphenylpropane, and in the formula (A), n indicates 2 or 3 and m indicates an integer from 1 to 15. 3. The plating solution according to claim 2 , wherein the additive further comprises a complexing agent and an antioxidant; or one of a complexing agent and an antioxidant. 4. The plating solution according to claim 1 , wherein the additive further comprises a complexing agent and an antioxidant; or one of a complexing agent and an antioxidant.

Assignees

Inventors

Classifications

  • C25D3/32Primary

    characterised by the organic bath constituents used · CPC title

  • containing more than 50% by weight of tin · CPC title

  • Semiconductors · CPC title

  • Electroplating with layers of varying thickness · CPC title

  • by direct electroplating · CPC title

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What does patent US10329680B2 cover?
A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing sulfonium salt with one or more of aromatic rings is provided.
Who is the assignee on this patent?
Mitsubishi Materials Corp
What technology area does this patent fall under?
Primary CPC classification C25D3/32. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Jun 25 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).