Plating solution using ammonium salt

Patent metadata

Field	Value
Publication number	US-10450665-B2
Application number	US-201615560300-A
Country	US
Kind code	B2
Filing date	Mar 24, 2016
Priority date	Mar 26, 2015
Publication date	Oct 22, 2019
Grant date	Oct 22, 2019

Abstract

A plating solution including a soluble salt containing at least a stannous salt; an acid selected from organic acid and inorganic acid or a salt thereof; and an additive containing a specific ammonium salt is provided.

First claim

What is claimed is:

1. A plating solution comprising:
(A) a soluble salt containing at least a stannous salt;
(B) an acid selected from organic acid and inorganic acid or a salt of the acid; and
(C) an additive, wherein
the additive comprises a ammonium salt represented by a general formula (1) below,

wherein, in the formula (1),
R 1 indicates C n H 2n+1 , n being an integer of 10 to 16,
R 2 and R 3 are identical or different, and indicate C n H 2n+1 , n being an integer of 1 to 2,
X represents a halogen, and
Y represents (CH 2 —CH 2 —O) 2 .

2. The plating solution according to claim 1 , wherein
the additive further comprises a nonionic surfactant represented by a general formula (2) below,
R 3 —Y 1 —Z—Y 2 —R 4   (2)

and wherein, in the formula (2), R 3 and R 4 is the group represented by the formula (A) below,
—(C n H 2n —O) m —H  (A)

and wherein, Y 1 and Y 2 represent a single bond or a group selected from —O—, —COO— and —CONH—; and Z represents a benzene ring or 2,2-diphenylpropane, and
in the formula (A), n indicates 2 or 3 and m indicates an integer from 1 to 15.

3. The plating solution according to claim 1 , further comprising an additional additive of a complexing agent, a brightener, or an antioxidant.

4. The plating solution according to claim 2 , further comprising an additional additive of a complexing agent, a brightener, or an antioxidant.

5. The plating solution according to claim 1 , wherein
the amount of the ammonium salt in the plating solution is 0.5 to 10 g/L.

6. The plating solution according to claim 1 , wherein
the amount of the ammonium salt in the plating solution is 1 to 10 g/L.

7. The plating solution according to claim 1 , wherein
the amount of the soluble salt containing at least a stannous salt in the plating solution is 30 to 100 g/L.

8. The plating solution according to claim 1 , wherein
the amount of the inorganic acid, the organic acid or the salt thereof (B) in the plating solution is 80 to 300 g/L.

9. The plating solution according to claim 1 , consisting essentially of:
(A) a soluble salt containing at least a stannous salt;
(B) an acid selected from organic acid and inorganic acid or a salt of the acid; and
(C) an additive, wherein
the additive consists essentially of:
(i) a ammonium salt represented by a general formula (1) below,
(ii) a nonionic surfactant represented by a general formula (2) below, and
(iii) an additional additive of a complexing agent, a brightener, or an antioxidant,

wherein, in the formula (1),
R 1 indicates C n H 2n+1 , n being an integer of 10 to 16,
R 2 and R 3 are identical or different, and indicate C n H 2n+1 , n being an integer of 1 to 2,
X represents a halogen, and
Y represents (CH 2 —CH 2 —O) 2 ,
R 3 —Y 1 —Z—Y 2 —R 4   (2)

and wherein, in the formula (2), R 3 and R 4 is the group represented by the formula (A) below,
—(C n H 2n —O) m —H  (A)

and wherein, Y 1 and Y 2 represent a single bond or a group selected from —O—, —COO— and —CONH—; and Z represents a benzene ring or 2,2-diphenylpropane, and
in the formula (A), n indicates 2 or 3 and m indicates an integer from 1 to 15.

10. The plating solution according to claim 1 , consisting of:
(A) a soluble salt containing at least a stannous salt;
(B) an acid selected from organic acid and inorganic acid or a salt of the acid; and
(C) an additive, wherein
the additive consists of:
(i) a ammonium salt represented by a general formula (1) below,
(ii) a nonionic surfactant represented by a general formula (2) below, and
(iii) an additional additive of a complexing agent, a brightener, or an antioxidant,

wherein, in the formula (1),
R 1 indicates C n H 2n+1 , n being an integer of 10 to 16,
R 2 and R 3 are identical or different, and indicate C n H 2n+1 , n being an integer of 1 to 2,
X represents a halogen, and
Y represents (CH 2 —CH 2 —O) 2 ,
R 3 —Y 1 —Z—Y 2 —R 4   (2)

and wherein, in the formula (2), R 3 and R 4 is the group represented by the formula (A) below,
—(C n H 2n —O) m —H  (A)

and wherein, Y 1 and Y 2 represent a single bond or a group selected from —O—, —COO— and —CONH—; and Z represents a benzene ring or 2,2-diphenylpropane, and
in the formula (A), n indicates 2 or 3 and m indicates an integer from 1 to 15.

Assignees

• Mitsubishi Materials Corp

Inventors

• Watanabe Mami
• Nakaya Kiyotaka

Classifications

• H10W72/01235

  by plating, e.g. electroless plating or electroplating · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• C25D3/60

  containing more than 50% by weight of tin · CPC title

• H05K3/4007

  Surface contacts, e.g. bumps (H05K3/4092 takes precedence; deposition of finish layers on pads H05K3/24; forming solder bumps H05K3/3465) · CPC title

• C25D3/32 Primary

  characterised by the organic bath constituents used · CPC title