Methods for forming films on substrates
US-12473639-B2 · Nov 18, 2025 · US
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Shaviv Roey patents
Shaviv Roey is listed as an inventor on 91 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Shaviv Roey |
| Total patents | 91 |
| First publication | May 19, 2015 |
| Latest publication | Nov 18, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Apparatus and method for controlling a flow process material to a deposition chamber
US-12438011-B2 · Oct 7, 2025 · US
Low Resistance and High Reliability Metallization Module
US-2025029874-A1 · Jan 23, 2025 · US
Low resistance and high reliability metallization module
US-12148660-B2 · Nov 19, 2024 · US
Methods of using a segmented showerhead for uniform delivery of multiple pre-cursors
US-12043895-B2 · Jul 23, 2024 · US
Showerhead for providing multiple materials to a process chamber
US-11970775-B2 · Apr 30, 2024 · US
Methods and apparatus for forming dual metal interconnects
US-11948885-B2 · Apr 2, 2024 · US
Segmented showerhead for uniform delivery of multiple precursors
US-11834743-B2 · Dec 5, 2023 · US
Evaporator chamber for forming films on substrates
US-11692261-B2 · Jul 4, 2023 · US
Alignment module with a cleaning chamber
US-11637004-B2 · Apr 25, 2023 · US
Recent patents
Latest publications not already listed above.
Segmented showerhead for uniform delivery of multiple pre-cursors
US-2023092987-A1 · Mar 23, 2023 · US
Methods for forming films on substrates
US-2023042777-A1 · Feb 9, 2023 · US
System and method for aligning a mask with a substrate
US-11538706-B2 · Dec 27, 2022 · US
Methods for forming films on substrates
US-11505863-B2 · Nov 22, 2022 · US
Apparatus and method for controlling a flow process material to a deposition chamber
US-2022351988-A1 · Nov 3, 2022 · US
Processing system for forming layers
US-11414740-B2 · Aug 16, 2022 · US
Apparatus and method for controlling a flow process material to a deposition chamber
US-11393703-B2 · Jul 19, 2022 · US
Low resistance and high reliability metallization module
US-2022108917-A1 · Apr 7, 2022 · US
Methods and apparatus for forming dual metal interconnects
US-2021320064-A1 · Oct 14, 2021 · US
Enhanced plating bath and additive chemistries for cobalt plating
US-11118278-B2 · Sep 14, 2021 · US
Methods and apparatus for forming dual metal interconnects
US-11075165-B2 · Jul 27, 2021 · US
Magnetized substrate carrier apparatus with shadow mask for deposition
US-11056277-B2 · Jul 6, 2021 · US
Substrate carrier having hard mask
US-11047039-B2 · Jun 29, 2021 · US
Methods and apparatus for hybrid feature metallization
US-11024537-B2 · Jun 1, 2021 · US
Methods and apparatus for filling a feature disposed in a substrate
US-10950500-B2 · Mar 16, 2021 · US
Vapor delivery methods and apparatus
US-2021069745-A1 · Mar 11, 2021 · US
Methods and apparatus for hybrid feature metallization
US-2021043506-A1 · Feb 11, 2021 · US
Evaporator chamber for forming films on substrates
US-2021025048-A1 · Jan 28, 2021 · US
Methods and apparatus for forming dual metal interconnects
US-2021020569-A1 · Jan 21, 2021 · US
Processing system for forming layers
US-2020385851-A1 · Dec 10, 2020 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 88 |
| Novellus Systems Inc | 3 |
| Shaviv Roey | 2 |
| Ostrowski Kirk | 1 |
| Cheung David | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/056 | 42 |
| H10W20/4403 | 34 |
| H10W20/043 | 30 |
| H10W20/033 | 29 |
| H10W20/4437 | 28 |