Substrate carrier having hard mask

US11047039B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-11047039-B2
Application numberUS-201816232496-A
CountryUS
Kind codeB2
Filing dateDec 26, 2018
Priority dateJan 8, 2018
Publication dateJun 29, 2021
Grant dateJun 29, 2021

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Substrate carrier apparatus having a hard mask are disclosed herein. In some embodiments, a substrate carrier apparatus includes a carrier body having a support surface to support a substrate; and a mask assembly disposed above the support surface. The mask assembly includes an annular frame disposed atop the support surface; and a hard mask coupled to and disposed within the annular frame above the support surface, wherein the hard mask includes one or more openings arranged in a predetermined pattern and disposed through the hard mask, and wherein the hard mask includes a plurality of spacer elements extending from a bottom surface of the hard mask.

First claim

Opening claim text (preview).

The invention claimed is: 1. A substrate carrier apparatus, comprising: a carrier body having a support surface to support a substrate; and a mask assembly disposed above the support surface, the mask assembly comprising: an annular frame disposed atop the support surface; and a hard mask coupled to and disposed within the annular frame above the support surface, wherein the hard mask includes one or more openings arranged in a predetermined pattern and disposed through the hard mask, and wherein the hard mask includes a plurality of spacer elements extending from a bottom surface of the hard mask. 2. The substrate carrier apparatus of claim 1 , further comprising: a flexure element coupled to the annular frame and configured to compensate for substrate thickness variations. 3. The substrate carrier apparatus of claim 2 , wherein the flexure element includes a plurality of springs, each of which is coupled to the annular frame at a first end, and a corresponding plurality of coupling bodies, each of which is coupled to a corresponding one of the plurality of springs at a second end of the spring opposite the annular frame, and wherein the plurality of coupling bodies are coupled to an upper surface of the hard mask. 4. The substrate carrier apparatus of claim 2 , wherein the flexure element comprises one or more elastomeric elements disposed between the annular frame and the support surface. 5. The substrate carrier apparatus of claim 1 , wherein the plurality of spacer elements are configured to maintain a predetermined gap between the hard mask and the substrate between about 20 μm and about 50 μm, when the substrate is disposed atop the support surface. 6. The substrate carrier apparatus of claim 1 , further comprising: one or more magnets disposed in the carrier body beneath the support surface in an area beneath the annular frame to bias the annular frame towards the carrier body. 7. The substrate carrier apparatus of claim 1 , wherein the hard mask further comprises one or more protrusions extending from the bottom surface of the hard mask and configured to prevent deflection of the hard mask towards the substrate beyond a predetermined deflection. 8. The substrate carrier apparatus of claim 1 , wherein the carrier body is formed of a non-metallic material. 9. The substrate carrier apparatus of claim 1 , wherein a thickness of the hard mask is between about 20 μm and about 50 μm. 10. The substrate carrier apparatus of claim 1 , wherein the support surface is textured. 11. The substrate carrier apparatus of claim 1 , wherein the carrier body is a portable electrostatic chuck. 12. A substrate carrier apparatus, comprising: a carrier body having a support surface to support a substrate; and a mask assembly disposed above the support surface, the mask assembly comprising: an annular frame disposed atop the support surface; a hard mask coupled to and disposed within the annular frame above the support surface, wherein the hard mask includes one or more openings arranged in a predetermined pattern and disposed through the hard mask, and wherein the hard mask includes a plurality of spacer elements extending from a bottom surface of the hard mask to maintain a predetermined gap between the hard mask and the substrate between about 20 μm and about 50 μm, when the substrate is disposed atop the support surface; and a flexure element coupled to the annular frame and configured to compensate for substrate thickness variations. 13. The substrate carrier apparatus of claim 12 , wherein the flexure element includes a plurality of springs, each of which is coupled to the annular frame at a first end, and a corresponding plurality of coupling bodies, each of which is coupled to a corresponding one of the plurality of springs at a second end of the spring opposite the annular frame, and wherein the plurality of coupling bodies are coupled to an upper surface of the hard mask. 14. The substrate carrier apparatus of claim 12 , wherein the flexure element comprises one or more elastomeric elements disposed between the annular frame and the support surface. 15. The substrate carrier apparatus of claim 12 , further comprising: one or more magnets disposed in the carrier body beneath the support surface in an area beneath the annular frame to bias the annular frame towards the carrier body. 16. The substrate carrier apparatus of claim 12 , wherein the hard mask further comprises one or more protrusions extending from the bottom surface of the hard mask and configured to prevent deflection of the hard mask towards the substrate beyond a predetermined deflection. 17. The substrate carrier apparatus of claim 12 , wherein the carrier body is formed of a non-metallic material. 18. The substrate carrier apparatus of claim 12 , wherein a thickness of the hard mask is between about 20 μm and about 50 μm. 19. The substrate carrier apparatus of claim 12 , wherein the support surface is textured. 20. The substrate carrier apparatus of claim 12 , wherein the carrier body is a portable electrostatic chuck.

Assignees

Inventors

Classifications

  • H10P72/165Primary

    characterised by a material, a roughness, a coating or the like · CPC title

  • C23C14/042Primary

    using masks · CPC title

  • C23C14/50Primary

    Substrate holders · CPC title

  • Vacuum evaporation · CPC title

  • characterised by coupling elements, kinematic members, handles or elements to be externally gripped · CPC title

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What does patent US11047039B2 cover?
Substrate carrier apparatus having a hard mask are disclosed herein. In some embodiments, a substrate carrier apparatus includes a carrier body having a support surface to support a substrate; and a mask assembly disposed above the support surface. The mask assembly includes an annular frame disposed atop the support surface; and a hard mask coupled to and disposed within the annular frame abov…
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/165. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jun 29 2021 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).