Thermal management in integrated circuit using phononic bandgap structure
US-12532772-B2 · Jan 20, 2026 · US
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Revier Daniel Lee patents
Revier Daniel Lee is listed as an inventor on 69 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Revier Daniel Lee |
| Total patents | 69 |
| First publication | Sep 6, 2018 |
| Latest publication | Jan 20, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
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Methods and apparatus for surface wetting control
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Thermally conductive wafer layer
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3D printed semiconductor package
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Additive process for circular printing of electronic devices
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Recent patents
Latest publications not already listed above.
Thermally conductive wafer layer
US-11854933-B2 · Dec 26, 2023 · US
Liquid metal mems switch
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Liquid metal MEMS switch
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Lens cleaning via electrowetting
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Nanoparticle backside die adhesion layer
US-11676930-B2 · Jun 13, 2023 · US
Methods and apparatus for electrostatic control of expelled material for lens cleaners
US-11607704-B2 · Mar 21, 2023 · US
Methods and apparatus for digital material deposition onto semiconductor wafers
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Microelectronic device substrate formed by additive process
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3D printed semiconductor package
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Microelectronic device substrate formed by additive process
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Thermally conductive wafer layer
US-2022208640-A1 · Jun 30, 2022 · US
Nanoparticle matrix for backside heat spreading
US-11355414-B2 · Jun 7, 2022 · US
Molded packaged antenna
US-11271296-B2 · Mar 8, 2022 · US
Nanoparticle backside die adhesion layer
US-2021265299-A1 · Aug 26, 2021 · US
Methods and apparatus for digital material deposition onto semiconductor wafers
US-2021200094-A1 · Jul 1, 2021 · US
Nanoparticle backside die adhesion layer
US-11031364-B2 · Jun 8, 2021 · US
Lens cleaning via electrowetting
US-2021157130-A1 · May 27, 2021 · US
Thermal Management in Integrated Circuit Using Phononic Bandgap Structure
US-2021151357-A1 · May 20, 2021 · US
3d printed semiconductor package
US-2021151551-A1 · May 20, 2021 · US
Additive process for circular printing
US-2021138727-A1 · May 13, 2021 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Texas Instruments Inc | 69 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/884 | 41 |
| H10W90/736 | 37 |
| H10W90/756 | 36 |
| H10W74/00 | 28 |
| H10W74/111 | 26 |