Nanoparticle matrix for backside heat spreading

Patent metadata

Field	Value
Publication number	US-11355414-B2
Application number	US-201916586720-A
Country	US
Kind code	B2
Filing date	Sep 27, 2019
Priority date	Sep 27, 2019
Publication date	Jun 7, 2022
Grant date	Jun 7, 2022

Abstract

In described examples, a circuit (e.g., an integrated circuit) includes a semiconductor substrate that includes a frontside surface and a backside surface. A circuit element is included at the frontside surface. An optional electrical insulator layer can be included adjacent to the backside surface. A distributor layer is included adjacent to the backside surface. In some examples, the distributor layer includes a distributor material that includes a matrix of cohered nanoparticles and metallic particles embedded by the cohered nanoparticles.

First claim

What is claimed is:

1. A circuit comprising:
a semiconductor substrate including a frontside surface and a backside surface;
a circuit element at the frontside surface;
a distributor material over the backside surface of the semiconductor substrate, the distributor material including a matrix of cohered nanoparticles and metallic particles embedded by the cohered nanoparticles; and
an electrical insulator layer between the backside surface of the semiconductor substrate and the distributor material.

2. The circuit of claim 1 , wherein the distributor material has an in-plane thermal conductivity of at least 150 watts/(meter×® K), and wherein the distributor material has an electrical resistivity of less than 100 micro-ohm-centimeters.

3. The circuit of claim 1 , the electrical insulator layer contains a via having a first end and a second end, the first end contacting the circuit element, and the second end contacting the distributor material.

4. The circuit of claim 1 , wherein the backside surface is less than 100 microns from the circuit element.

5. The circuit of claim 4 , wherein the cohered nanoparticles include graphitic platelets.

6. The circuit of claim 4 , wherein the metallic particles include silver (Ag).

7. The circuit of claim 1 , wherein the distributor material is coupled to conduct electricity.

8. The circuit of claim 1 , wherein the distributor material is coupled to conduct power to the circuit element.

9. The circuit of claim 8 , wherein the electrical insulator layer includes boron nitride (BN).

10. The circuit of claim 9 , comprising bonding wires attached at the frontside surface.

11. A circuit comprising:
a semiconductor substrate including a frontside surface and a backside surface;
a circuit element arranged on the semiconductor substrate;
an electrical insulator layer having a first electrical insulator layer surface over the backside surface and having a second electrical insulator layer surface opposite the first electrical insulator layer surface;
a distributor material having a first distributor material surface over the second electrical insulator layer surface and having a second distributor material surface opposite the first distributor material surface, wherein the distributor material includes a matrix of cohered nanoparticles and metallic particles embedded by the cohered nanoparticles;
an adhesion layer having a first adhesion layer surface over the second distributor material surface and having a second adhesion layer surface opposite the first adhesion layer surface; and
a mounting substrate having a mounting substrate surface over the second adhesion layer surface.

12. The circuit of claim 11 , comprising a bonding wire attached at the frontside surface and attached at the mounting substrate surface.

13. The circuit of claim 12 , wherein the mounting substrate surface is a first mounting substrate surface and the mounting substrate has a second mounting substrate surface that is opposite to the first mounting substrate surface; and comprising a lead at the second mounting substrate surface.

14. The circuit of claim 13 , wherein the lead is electrically coupled to the distributor material through the mounting substrate and through the adhesion layer.

15. The circuit of claim 14 , wherein the electrical insulator layer contains a via having a first end and a second end, the first end contacting the circuit element, and the second end contacting the distributor material.

16. A method, comprising:
forming a circuit element at a frontside surface of a semiconductor substrate, wherein the frontside surface is opposite to a backside surface of the semiconductor substrate;
forming an electrical insulator layer over the backside surface of the semiconductor substrate; and
layering a distributor material over the electrical insulation layer, wherein the distributor material includes a matrix of cohered nanoparticles and metallic particles embedded by the cohered nanoparticles.

17. The method of claim 16 , wherein the distributor material is layered by a PECVD process (a plasma enhanced chemical vapor deposition process), wherein the PECVD process includes methane and hydrogen for forming nanoparticles of the matrix, and wherein the distributor material that is 100 nanometers to 5 microns thick.

18. The method of claim 17 , further comprising forming a via through the electrical insulator layer and into the backside surface of the semiconductor substrate, the via having an end contacting the distributor material.

19. The method of claim 16 , wherein the metallic particles include silver (Ag).

20. The method of claim 16 , further comprising forming an electrical conductor between the distributor material and the circuit element.

Assignees

• Texas Instruments Inc

Inventors

• Cook Benjamin Stassen
• Dadvand Nazila
• Revier Daniel Lee
• Venugopal Archana

Classifications

• H10W72/551

  Materials of bond wires · CPC title

• H10W72/884

  Die-attach connectors and bond wires · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/942

  relative to underlying supporting features, e.g. bond pads, RDLs or vias · CPC title

• H10W72/953

  not comprising solid metals or solid metalloids, e.g. polymers, ceramics or liquids · CPC title