Debubbler component
US-D1118897-S · Mar 17, 2026 · US
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Rash Robert patents
Rash Robert is listed as an inventor on 82 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Rash Robert |
| Total patents | 82 |
| First publication | Mar 5, 2015 |
| Latest publication | Mar 17, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Debubbler component
US-D1112391-S · Feb 10, 2026 · US
Debubbler component
US-D1096679-S · Oct 7, 2025 · US
Debubbler component
US-D1091491-S · Sep 2, 2025 · US
Debubbler component
US-D1090468-S · Aug 26, 2025 · US
Gap characterization in electrodeposition tool
US-2025179680-A1 · Jun 5, 2025 · US
Low angle membrane frame for an electroplating cell
US-12281402-B2 · Apr 22, 2025 · US
Control of dissolved gas concentration in electroplating baths
US-2024200223-A1 · Jun 20, 2024 · US
Electrodeposition of metals using an ionically resistive ionically permeable element or a shield spatially tailored to die-level patterns on a substrate
US-2024141541-A1 · May 2, 2024 · US
Spatially and dimensionally non-uniform channelled plate for tailored hydrodynamics during electroplating
US-2024076795-A1 · Mar 7, 2024 · US
Recent patents
Latest publications not already listed above.
Blended contact fingers for preventing cracks during thin substrate handling
US-2023175161-A1 · Jun 8, 2023 · US
Flow assisted dynamic seal for high-convection, continuous-rotation plating
US-11655556-B2 · May 23, 2023 · US
Electroplating apparatus for tailored uniformity profile
US-11549192-B2 · Jan 10, 2023 · US
Low angle membrane frame for an electroplating cell
US-2022298667-A1 · Sep 22, 2022 · US
Substrate sticking and breakage mitigation
US-2022220627-A1 · Jul 14, 2022 · US
Electroplating apparatus for tailored uniformity profile
US-2021148001-A1 · May 20, 2021 · US
Methods and apparatus for flow isolation and focusing during electroplating
US-11001934-B2 · May 11, 2021 · US
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
US-10982346-B2 · Apr 20, 2021 · US
One-piece anode for tuning electroplating at an edge of a substrate
US-10975489-B2 · Apr 13, 2021 · US
High flow multi-way piston valve for deposition systems
US-10969036-B2 · Apr 6, 2021 · US
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
US-10923340-B2 · Feb 16, 2021 · US
Electroplating apparatus for tailored uniformity profile
US-10920335-B2 · Feb 16, 2021 · US
Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
US-10781527-B2 · Sep 22, 2020 · US
Method and apparatus for synchronized pressure regulation of separated anode chamber
US-10760178-B2 · Sep 1, 2020 · US
Flow Assisted Dynamic Seal for High-Convection, Continuous-Rotation Plating
US-2020232114-A1 · Jul 23, 2020 · US
One-piece anode for tuning electroplating at an edge of a substrate
US-2020173052-A1 · Jun 4, 2020 · US
Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplating
US-10662545-B2 · May 26, 2020 · US
Flow assisted dynamic seal for high-convection, continuous-rotation plating
US-10612151-B2 · Apr 7, 2020 · US
Method and apparatus for synchronized pressure regulation of separated anode chamber
US-2020017989-A1 · Jan 16, 2020 · US
High flow multi-way piston valve for deposition systems
US-2019368630-A1 · Dec 5, 2019 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Lam Res Corp | 53 |
| Novellus Systems Inc | 29 |
| Mayer Steven T | 1 |
| Ponnuswamy Thomas A | 1 |
| Chua Lee Peng | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| C25D17/001 | 73 |
| C25D7/123 | 49 |
| C25D21/12 | 42 |
| C25D17/002 | 40 |
| C25D7/12 | 40 |