One-piece anode for tuning electroplating at an edge of a substrate

Patent metadata

Field	Value
Publication number	US-10975489-B2
Application number	US-201816206700-A
Country	US
Kind code	B2
Filing date	Nov 30, 2018
Priority date	Nov 30, 2018
Publication date	Apr 13, 2021
Grant date	Apr 13, 2021

Abstract

An active (consumable) anode includes, in one aspect, a generally annular body and a protrusion used for connecting the anode to the power supply, where the protrusion extends outward from the generally annular body of the anode. The compositions of the generally annular body and of the protrusion are the same, and, in some embodiments, the anode is a one-piece anode that does not include any welding seams. Such structure results in reduced voltage fluctuations during plating and in improved control over plating uniformity. In some embodiments, the anode is a copper anode, a cobalt anode, or a nickel anode machined from a single sheet of anode-grade metal. The provided anode can be used in an electroplating apparatus as a secondary, peripherally disposed anode, in conjunction with a more centrally located primary anode. The provided anode is configured to modulate electroplating at the edge of the substrate.

First claim

The invention claimed is:

1. An active anode comprising:
a generally annular body having an inner surface and an outer surface; and
a protrusion extending outward from the outer surface, wherein the active anode is a single-piece copper anode, wherein copper in the active anode has an average grain size of between about 150 μm and about 450 μm, and wherein compositions of the generally annular body and of the protrusion are the same.

2. The active anode of claim 1 , wherein the single-piece copper anode comprises copper (Cu) and phosphorus (P).

3. The active anode of claim 2 , wherein the single-piece copper anode comprises at least about 99.9% copper and between about 400 and about 650 ppm phosphorus by weight.

4. The active anode of claim 1 , wherein the protrusion comprises an opening at a distal terminus of the protrusion, and wherein the distal terminus of the protrusion surrounding the opening is recessed.

5. The active anode of claim 1 , wherein the generally annular body of the active anode has an inner diameter of at least about 317.5 mm and an outer diameter of no larger than about 355.6 mm.

6. The active anode of claim 1 , wherein the generally annular body of the active anode has an inner diameter of about 330 mm and an outer diameter of about 352 mm.

7. The active anode of claim 1 , wherein the protrusion has a maximum width of between about 8 mm and about 10 mm.

8. The active anode of claim 1 , wherein the protrusion has a maximum width of about 9 mm.

9. The active anode of claim 1 , wherein the annular body and the protrusion have maximum thickness of about 10 mm.

10. The active anode of claim 1 , wherein a length of the protrusion is between about 33 mm and about 37 mm.

11. An active anode comprising:
a generally annular body having an inner surface and an outer surface; and
a protrusion extending outward from the outer surface, wherein the active anode is a copper anode, a cobalt anode, or a nickel anode, wherein compositions of the generally annular body and of the protrusion are the same, wherein the generally annular body has an inner diameter of at least about 318 mm and an outer diameter of no larger than about 355 mm; wherein the protrusion has an opening at a distal terminus of the protrusion, wherein a distance between a center of an annulus defining the generally annular body and a center of the opening at the distal terminus of the protrusion is between about 197 mm and about 217 mm.

12. An electroplating apparatus for electroplating a metal on a substrate, the apparatus comprising:
(a) a plating chamber configured to contain an electrolyte, the plating chamber comprising a catholyte compartment and an anolyte compartment, wherein the anolyte compartment and the catholyte compartment are separated by an ion-permeable membrane;
(b) a substrate holder configured to hold and rotate the substrate in the catholyte compartment during electroplating;
(c) a primary anode positioned in the anolyte compartment of the plating chamber;
(d) an ionically resistive ionically permeable element positioned between the ion-permeable membrane and the substrate holder, wherein the ionically resistive ionically permeable element is adapted to provide ionic transport through the element during electroplating; and
(e) a secondary anode configured to donate plating current to the substrate, wherein the secondary anode is positioned such that the donated current does not cross the ion-permeable membrane separating the anolyte and catholyte compartments, and wherein the secondary anode is positioned such as to donate plating current through the ionically resistive ionically permeable element, wherein the secondary anode comprises a generally annular body having an inner surface and an outer surface; and at least one protrusion extending outward from the outer surface, wherein the active anode is a copper anode, cobalt anode, or a nickel anode, and wherein compositions of the generally annular body and of the at least one protrusion of the secondary anode are the same.

13. The apparatus of claim 12 , wherein the secondary anode is a single-piece copper anode.

14. The apparatus of claim 12 , wherein the secondary anode is a single-piece cobalt anode.

15. The apparatus of claim 12 , wherein the secondary anode is positioned in a secondary anode compartment around the periphery of the plating chamber.

16. The apparatus of claim 12 , wherein the at least one protrusion of the anode is electrically connected to a power supply via a metal coupling and a power supply cable.

17. The active anode of claim 1 , wherein the protrusion comprises an opening at a distal terminus of the protrusion.

Assignees

• Lam Res Corp

Inventors

• Fortner James Isaac
• Rash Robert

Classifications

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D17/008

  Current shielding devices · CPC title

• C25D5/08

  Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)} · CPC title

• C25D17/12 Primary

  Shape or form (C25D17/14 takes precedence) · CPC title

• C25D17/10 Primary

  Electrodes {, e.g. composition, counter electrode} · CPC title