Method and apparatus for synchronized pressure regulation of separated anode chamber

Patent metadata

Field	Value
Publication number	US-10760178-B2
Application number	US-201816033839-A
Country	US
Kind code	B2
Filing date	Jul 12, 2018
Priority date	Jul 12, 2018
Publication date	Sep 1, 2020
Grant date	Sep 1, 2020

Abstract

Electroplating results can be improved by dynamically controlling the pressure in different parts of an electroplating apparatus. For example, a number of plating problems can be avoided by ensuring that the pressure in an anode chamber always remains slightly above the pressure in an ionically resistive element manifold, both during electroplating and during non-electroplating operations. This pressure differential prevents the membrane from stretching downward into the anode chamber.

First claim

What is claimed is:

1. A method of dynamically controlling pressure in an electroplating apparatus, the method comprising:
(a) receiving a substrate in the electroplating apparatus, the electroplating apparatus comprising:
a plating chamber configured to contain an electrolyte and an anode while electroplating metal onto the substrate, the substrate being substantially planar,
a substrate support configured to support the substrate such that a plating face of the substrate is immersed in the electrolyte and separated from the anode during plating,
an ionically resistive element adapted to provide ionic transport through the ionically resistive element during electroplating, wherein the ionically resistive element is a plate comprising a plurality of through-holes,
a membrane adapted to provide ionic transport through the membrane during electroplating,
an ionically resistive element manifold positioned below the ionically resistive element and above the membrane, and
an anode chamber positioned below the membrane and containing the anode;

(b) immersing the substrate in the electrolyte and electroplating material onto the substrate;
(c) removing the substrate from the plating chamber; and
(d) during (a)-(c), dynamically controlling a pressure in the anode chamber such that the pressure in the anode chamber is always between about 690-6900 Pascal higher than a pressure in the ionically resistive element manifold.

2. The method of claim 1 , wherein the pressure in the anode chamber is higher when electroplating material onto the substrate in (b) compared to when loading or unloading the substrate in (a) or (c).

3. The method of claim 2 , wherein: (i) during (a) and (c), the pressure in the anode chamber is between about 690-2070 Pascal and the pressure in the ionically resistive element manifold is between about 0-1380 Pascal and (ii) during (b) when the substrate is being electroplated, the pressure in the anode chamber is between about 1380-4830 Pascal and the pressure in the ionically resistive element manifold is between about 690-4140 Pascal.

4. The method of claim 1 , wherein the pressure in the anode chamber is dynamically controlled by varying a flow rate of electrolyte into the anode chamber.

5. The method of claim 4 , wherein during (a) and (c), a flow rate of electrolyte through a pump that feeds the anode chamber is between about 0.3-2.0 L/min and during (b) when the substrate is being electroplated, the flow rate of electrolyte through the pump that feeds the anode chamber is between about 1.0-4.0 L/min.

6. The method of claim 4 , wherein the flow rate of electrolyte into the anode chamber is dynamically controlled based on a position of the substrate support.

7. The method of claim 4 , wherein the electroplating apparatus further comprises a first pressure sensor for determining a pressure in the anode chamber and a second pressure sensor for determining a pressure in the ionically resistive element manifold, wherein the flow rate of electrolyte into the anode chamber is dynamically controlled based a difference between the pressure in the anode chamber determined by the first pressure sensor and the pressure in the ionically resistive element manifold determined by the second pressure sensor.

8. The method of claim 1 , wherein the pressure in the anode chamber is dynamically controlled by varying a restriction on electrolyte leaving the anode chamber.

9. The method of claim 8 , wherein the restriction on electrolyte leaving the anode chamber is varied by dynamically controlling a position of a valve that affects the electrolyte leaving the anode chamber.

10. The method of claim 1 , wherein during (a)-(c), the pressure in the anode chamber is between about 690-1380 Pascal higher than a pressure in the ionically resistive element manifold.

11. An apparatus for electroplating, the apparatus comprising:
a plating chamber configured to contain an electrolyte and an anode while electroplating metal onto a substrate, the substrate being substantially planar;
a substrate support configured to support the substrate such that a plating face of the substrate is immersed in the electrolyte and separated from the anode during plating;
an ionically resistive element adapted to provide ionic transport through the ionically resistive element during electroplating, wherein the ionically resistive element is a plate comprising a plurality of through-holes;
a membrane adapted to provide ionic transport through the membrane during electroplating;
an ionically resistive element manifold positioned below the ionically resistive element and above the membrane;
an anode chamber positioned below the membrane and containing the anode; and
a controller configured with instructions to perform the following operation: dynamically control a pressure in the anode chamber when electrolyte is present in the anode chamber to thereby maintain the pressure in the anode chamber between about 690-6900 Pascal higher than a pressure in the ionically resistive element manifold.

12. The apparatus of claim 11 , wherein the controller is configured with instructions to perform the following operation: dynamically control the pressure in the anode chamber such that a first anode chamber pressure is established during electroplating and a second anode chamber pressure is established when the substrate is being loaded or unloaded from the substrate support, the first anode chamber pressure being greater than the second anode chamber pressure.

13. The apparatus of claim 12 , wherein the controller is configured with instructions to perform the following operation: cause a dynamic pressure in the ionically resistive element manifold, such that a first ionically resistive element manifold pressure is established during electroplating and a second ionically resistive element manifold pressure is established when the substrate is being loaded or unloaded from the substrate support, the first ionically resistive element manifold pressure being greater than the second ionically resistive element manifold pressure, wherein the first ionically resistive element manifold pressure is between about 690-4140 Pascal, the second ionically resistive element manifold pressure is between about 0-1380 Pascal, the first anode chamber pressure is between about 1380-4830 Pascal, and the second anode chamber pressure is between about 690-2070 Pascal.

14. The apparatus of claim 11 , wherein the pressure in the anode chamber is dynamically controlled by varying a flow rate of electrolyte into the anode chamber.

15. The apparatus of claim 14 , wherein the controller is configured with instructions to perform the following operation: cause an electrolyte flow rate through a pump feeding the anode chamber to be (i) between about 0.3-2.0 L/min when the substrate is being loaded or unloaded from the substrate support, and (ii) between about 1.0-4.0 L/min during electroplating.

16. The apparatus of claim 14 , wherein the controller is configured with instructions to perform the following operation: dynamically control the flow rate of electrolyte into the anode chamber based on a position of the substrate support.

17. The apparatus of claim 14 , further comprising:
a first pressure sensor for determining the pressure in the anode chamber; and
a second pressure sensor for determining the pressure in the ionically resistive element manifold, wherein the controller is configured with instructions to perform the following operation: dynamically control the flow rate of electrolyte into the anode chamber based on a difference between th

Assignees

• Lam Res Corp

Inventors

• Banik Ii Stephen J
• Buckalew Bryan L
• Wilmot Frederick Dean
• Rash Robert

Classifications

• C25D17/001 Primary

  Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells · CPC title

• C25D5/08

  Electroplating with moving electrolyte e.g. jet electroplating {(using locally applied jets of electrolyte C25D5/026)} · CPC title

• C25D21/14 Primary

  Controlled addition of electrolyte components · CPC title

• C25D21/12

  Process control or regulation (controlling or regulating in general G05) · CPC title

• C25D21/04 Primary

  Removal of gases or vapours {; Gas or pressure control} · CPC title