Molded power semiconductor package with gate connector feature
US-2023411254-A1 · Dec 21, 2023 · US
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Ofner Gerald patents
Ofner Gerald is listed as an inventor on 37 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ofner Gerald |
| Total patents | 37 |
| First publication | Jan 29, 2015 |
| Latest publication | Dec 21, 2023 |
Notable patents
Publications ranked by popularity score, then publication date.
Flat lead package formation method
US-11652084-B2 · May 16, 2023 · US
Multi-purpose non-linear semiconductor package assembly line
US-11302668-B2 · Apr 12, 2022 · US
Flat Lead Package Formation Method
US-2021043603-A1 · Feb 11, 2021 · US
Integrated circuit packages
US-10903166-B2 · Jan 26, 2021 · US
Package with vertical interconnect between carrier and clip
US-10707158-B2 · Jul 7, 2020 · US
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
US-2020203310-A1 · Jun 25, 2020 · US
Multi-purpose non-linear semiconductor package assembly line
US-10566309-B2 · Feb 18, 2020 · US
Microelectronic package having a passive microelectronic device disposed within a package body
US-10522454-B2 · Dec 31, 2019 · US
Integrated circuit packages
US-2019363052-A1 · Nov 28, 2019 · US
Recent patents
Latest publications not already listed above.
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
US-10301176-B2 · May 28, 2019 · US
Flexible band wearable electronic device
US-10228725-B2 · Mar 12, 2019 · US
Package-on-package stacked microelectronic structures
US-10211182-B2 · Feb 19, 2019 · US
Integrated circuit package
US-10157869-B2 · Dec 18, 2018 · US
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
US-10150668-B2 · Dec 11, 2018 · US
Microelectronic package having a passive microelectronic device disposed within a package body
US-2018286799-A1 · Oct 4, 2018 · US
Microelectromechanical system (mems) on application specific integrated circuit (asic)
US-2018186627-A1 · Jul 5, 2018 · US
Microelectronic package having a passive microelectronic device disposed within a package body
US-9997444-B2 · Jun 12, 2018 · US
Multi-Purpose Non-Linear Semiconductor Package Assembly Line
US-2018096966-A1 · Apr 5, 2018 · US
Passive electrical devices with a polymer carrier
US-9888577-B2 · Feb 6, 2018 · US
Chip arrangement and method for manufacturing a chip arrangement
US-9856136-B2 · Jan 2, 2018 · US
Package with vertical interconnect between carrier and clip
US-2017317016-A1 · Nov 2, 2017 · US
Microelectromechanical system (mems) on application specific integrated circuit (asic)
US-2017217766-A1 · Aug 3, 2017 · US
Electronic component and methods of manufacturing the same
US-2017178993-A1 · Jun 22, 2017 · US
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
US-9663353-B2 · May 30, 2017 · US
Integrated circuit package
US-2017103956-A1 · Apr 13, 2017 · US
Stress buffer layer for integrated microelectromechanical systems (MEMS)
US-9550670-B2 · Jan 24, 2017 · US
Hybrid exposure for semiconductor devices
US-9543224-B1 · Jan 10, 2017 · US
Microelectronic package having a passive microelectronic device disposed within a package body
US-2016358848-A1 · Dec 8, 2016 · US
Integrated circuit package
US-9472515-B2 · Oct 18, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Intel Ip Corp | 13 |
| Infineon Technologies Ag | 10 |
| Intel Corp | 9 |
| Intel Mobile Comm Gmbh | 4 |
| Intel Deutschland Gmbh | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/0198 | 27 |
| H10W90/724 | 24 |
| H10W90/00 | 19 |
| H10W72/072 | 18 |
| H10W74/00 | 18 |