Structure and method of forming a silicon germanium containing layered stack for use in semiconductor devices
US-2026040669-A1 · Feb 5, 2026 · US
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Naik Mehul patents
Naik Mehul is listed as an inventor on 73 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Naik Mehul |
| Total patents | 73 |
| First publication | May 21, 2015 |
| Latest publication | Feb 5, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of dielectric material fill and treatment
US-12543547-B2 · Feb 3, 2026 · US
Formation of gate all around device
US-2025261423-A1 · Aug 14, 2025 · US
Monolithic complementary field-effect transistors having carbon-doped release layers
US-2025194243-A1 · Jun 12, 2025 · US
Method and Apparatus for Forming Backside Power Rails
US-2025157851-A1 · May 15, 2025 · US
Monolithic complementary field-effect transistors having carbon-doped release layers
US-12262559-B2 · Mar 25, 2025 · US
Method of dielectric material fill and treatment
US-2024379420-A1 · Nov 14, 2024 · US
Fabrication of high aspect ratio electronic devices with minimal sidewall spacer loss
US-2024321641-A1 · Sep 26, 2024 · US
Method of dielectric material fill and treatment
US-12046508-B2 · Jul 23, 2024 · US
Methods and apparatus for forming backside power rails
US-12002705-B2 · Jun 4, 2024 · US
Recent patents
Latest publications not already listed above.
Method of forming nickel silicide materials
US-11965236-B2 · Apr 23, 2024 · US
Fully aligned subtractive processes and electronic devices therefrom
US-11967527-B2 · Apr 23, 2024 · US
Reverse selective etch stop layer
US-11955382-B2 · Apr 9, 2024 · US
Methods and devices for subtractive self-alignment
US-11908696-B2 · Feb 20, 2024 · US
Monolithic complementary field-effect transistors having carbon-doped release layers
US-2023326925-A1 · Oct 12, 2023 · US
Multi-step pre-clean for selective metal gap fill
US-11776806-B2 · Oct 3, 2023 · US
Methods and apparatus for processing a substrate
US-11749532-B2 · Sep 5, 2023 · US
Methods and apparatus for forming backside power rails
US-2023260825-A1 · Aug 17, 2023 · US
Method of dielectric material fill and treatment
US-2023187276-A1 · Jun 15, 2023 · US
Integrated contact silicide with tunable work functions
US-11626288-B2 · Apr 11, 2023 · US
Method of dielectric material fill and treatment
US-11615984-B2 · Mar 28, 2023 · US
Method of forming interconnect for semiconductor device
US-2023045689-A1 · Feb 9, 2023 · US
Integrated contact silicide with tunable work functions
US-2023034058-A1 · Feb 2, 2023 · US
Method of forming interconnect for semiconductor device
US-11508617-B2 · Nov 22, 2022 · US
Methods and apparatus for processing a substrate
US-2022359224-A1 · Nov 10, 2022 · US
Fully Aligned Subtractive Processes And Electronic Devices Therefrom
US-2022328352-A1 · Oct 13, 2022 · US
Multi-step pre-clean for selective metal gap fill
US-2022270871-A1 · Aug 25, 2022 · US
Fully aligned subtractive processes and electronic devices therefrom
US-11410885-B2 · Aug 9, 2022 · US
Multi-step pre-clean for selective metal gap fill
US-11380536-B2 · Jul 5, 2022 · US
Reverse selective etch stop layer
US-2022181204-A1 · Jun 9, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 73 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W20/0633 | 24 |
| H10W20/063 | 24 |
| H10W20/077 | 22 |
| H10W20/069 | 17 |
| H10W20/096 | 17 |