Methods and devices for subtractive self-alignment

Patent metadata

Field	Value
Publication number	US-11908696-B2
Application number	US-202217569870-A
Country	US
Kind code	B2
Filing date	Jan 6, 2022
Priority date	Jan 24, 2020
Publication date	Feb 20, 2024
Grant date	Feb 20, 2024

Abstract

A method of forming an interconnect structure for semiconductor devices is described. The method comprises depositing an etch stop layer on a substrate by physical vapor deposition followed by in situ deposition of a metal layer on the etch stop layer. The in situ deposition comprises flowing a plasma processing gas into the chamber and exciting the plasma processing gas into a plasma to deposit the metal layer on the etch stop layer on the substrate. The substrate is continuously under vacuum and is not exposed to ambient air during the deposition processes.

First claim

What is claimed is:

1. A processing tool comprising:
a central transfer station comprising a robot configured to move a wafer, the wafer continuously under vacuum and not exposed to ambient air; and
a plurality of process stations, each process station connected to the central transfer station and providing a processing region separated from processing regions of adjacent process stations, the plurality of process stations comprising a first physical vapor deposition chamber and a second physical vapor deposition chamber;
a controller connected to the central transfer station and the plurality of process stations, the controller configured to activate the robot to move the wafer between the first physical vapor deposition chamber and the second physical vapor deposition chamber without breaking vacuum, and to control a process occurring in each of the process stations,
wherein the controller controls a first process comprising depositing an etch stop layer on a substrate by physical vapor deposition in the first physical vapor deposition chamber at a temperature in a range of from about 200° C. to about 300° C., and
wherein the controller controls a second process comprising in situ depositing a metal layer on the etch stop layer by flowing a plasma processing gas into the second physical vapor deposition chamber at a temperature in a range of from about 200° C. to about 450° C. and exciting the plasma processing gas into a plasma to deposit the metal layer on the etch stop layer on the substrate.

2. The processing tool of claim 1 , wherein the first physical vapor deposition chamber includes a first target comprising one or more of titanium (Ti), titanium nitride (TiN), tantalum (Ta), tantalum nitride (TaN), molybdenum (Mo), tungsten (W), and ruthenium (Ru).

3. The processing tool of claim 2 , wherein the second physical vapor deposition chamber includes a second target comprising one or more of ruthenium (Ru), molybdenum (Mo), tungsten (W), copper (Cu), cobalt (Co), iridium (Ir), metal silicides, and metal alloys.

4. The processing tool of claim 1 , further comprising an RF power source with a power in a range of from about 1 kW to about 10 kW.

5. The processing tool of claim 1 , wherein the RF power source has a power in a range of from about 2 kW to about 3 kW.

6. The processing tool of claim 1 , further comprising a power source that negatively biases a metal target from about 500 W to about 10 kW to excite the plasma processing gas into a plasma.

7. The processing tool of claim 1 , wherein the plasma processing gas comprises one or more of neon (Ne), argon (Ar), krypton (Kr), xenon (Xe).

8. The processing tool of claim 1 , wherein the plasma processing gas comprises krypton (Kr).

9. The processing tool of claim 1 , wherein the controlled is configured to control a third process comprising depositing a metal seed on the etch stop layer prior to deposition of the metal layer, wherein deposition of the metal seed comprises flowing a plasma processing gas into the chamber and exciting the plasma processing gas into a plasma to deposit the metal seed on the etch stop layer.

10. The processing tool of claim 9 , wherein the metal seed comprises one or more of ruthenium (Ru), molybdenum (Mo), tungsten (W), copper (Cu), cobalt (Co), iridium (Ir), metal silicides, and metal alloys.

Assignees

• Applied Materials Inc

Inventors

• Ren He
• Jiang Hao
• Naik Mehul
• Hou Wenting
• Lei Jianxin
• Gong Chen
• Cao Yong

Classifications

• H10W20/074

  of dielectric parts comprising thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers · CPC title

• H10W20/045

  for deposition from the gaseous phase, e.g. for chemical vapour deposition [CVD] · CPC title

• H10W20/4432

  the principal metal being a noble metal, e.g. gold · CPC title

• H10P14/44 Primary

  Physical vapour deposition [PVD] · CPC title

• H10P72/0461

  characterised by the presence of two or more transfer chambers · CPC title