Photonic interconnects to enable communication between processor components and memory components
US-2026086301-A1 · Mar 26, 2026 · US
Mcmillan Wayne is listed as an inventor on 53 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Mcmillan Wayne |
| Total patents | 53 |
| First publication | Jul 6, 2017 |
| Latest publication | Mar 26, 2026 |
Publications ranked by popularity score, then publication date.
US-2026086301-A1 · Mar 26, 2026 · US
US-12181736-B2 · Dec 31, 2024 · US
US-12084761-B2 · Sep 10, 2024 · US
US-12050327-B2 · Jul 30, 2024 · US
US-2024184024-A1 · Jun 6, 2024 · US
US-11733533-B2 · Aug 22, 2023 · US
US-2023203647-A1 · Jun 29, 2023 · US
US-11662516-B2 · May 30, 2023 · US
US-11626321-B2 · Apr 11, 2023 · US
US-11614685-B2 · Mar 28, 2023 · US
Latest publications not already listed above.
US-11608558-B2 · Mar 21, 2023 · US
US-2023056086-A1 · Feb 23, 2023 · US
US-11557987-B2 · Jan 17, 2023 · US
US-2022392053-A1 · Dec 8, 2022 · US
US-11487139-B2 · Nov 1, 2022 · US
US-2022336270-A1 · Oct 20, 2022 · US
US-2022276498-A1 · Sep 1, 2022 · US
US-2022252780-A1 · Aug 11, 2022 · US
US-11333896-B2 · May 17, 2022 · US
US-11327218-B2 · May 10, 2022 · US
US-2022100084-A1 · Mar 31, 2022 · US
US-2022082738-A1 · Mar 17, 2022 · US
US-2022077794-A1 · Mar 10, 2022 · US
US-11226556-B2 · Jan 18, 2022 · US
US-11205978-B2 · Dec 21, 2021 · US
US-11187836-B2 · Nov 30, 2021 · US
US-10955606-B2 · Mar 23, 2021 · US
US-2020393599-A1 · Dec 17, 2020 · US
US-2020326621-A1 · Oct 15, 2020 · US
US-2020325576-A1 · Oct 15, 2020 · US
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Applied Materials Inc | 51 |
| Kla Tencor Corp | 2 |
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| G03F7/0002 | 20 |
| G02B5/1857 | 18 |
| G02B5/1847 | 13 |
| G03F7/0005 | 12 |
| G02B6/34 | 12 |