Handling and processing double-sided devices on fragile substrates

Patent metadata

Field	Value
Publication number	US-11205978-B2
Application number	US-201916713744-A
Country	US
Kind code	B2
Filing date	Dec 13, 2019
Priority date	Dec 14, 2018
Publication date	Dec 21, 2021
Grant date	Dec 21, 2021

Abstract

Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.

First claim

What is claimed is:

1. A substrate support assembly, comprising:
a plurality of projections coupled to a body of the substrate support assembly, each of the plurality of projections having a support surface corresponding to a portion of a surface of a substrate to be retained on the support surface; and
a plurality of pockets defined by adjacent projections of the plurality of projections, each of the plurality of pockets having:
a pocket width corresponding to a width of one or more devices disposed on the surface of the substrate to be retained on the support surface;
a pocket length corresponding to a length of the one or more devices disposed on the surface of the substrate to be retained on the support surface; and
a pocket conduit operable to be in fluid communication with a vacuum source via a respective vacuum flow controller of a plurality of vacuum flow controllers and operable to be in fluid communication with a gas source via a respective gas flow controller of a plurality of gas source controllers.

2. A substrate support assembly of claim 1 , comprising:
a plurality of projections coupled to a body of the substrate support assembly, each of the plurality of projections having a support surface corresponding to a portion of a surface of a substrate to be retained on the support surface; and
a plurality of pockets defined by adjacent projections of the plurality of projections, each of the plurality of pockets having:
a pocket width corresponding to a width of one or more devices disposed on the surface of the substrate to be retained on the support surface;
a pocket length corresponding to a length of the one or more devices disposed on the surface of the substrate to be retained on the support surface; and
a pocket conduit operable to be in fluid communication with a vacuum source via a vacuum flow controller and operable to be in fluid communication with a gas source via a gas flow controller, wherein the gas source is operable to provide gas through a respective pocket conduit to a respective pocket to at least one of:
pressurize a respective region defined by the substrate, adjacent projections, and the body of the substrate support assembly;
maintain the substrate at a cryogenic processing temperature; or
release the portion of the substrate from the support surface of the projections.

3. The substrate support assembly of claim 2 , wherein the gas source is an inert gas source.

4. The substrate support assembly of claim 3 , wherein inert gas of the inert gas source has a cryogenic temperature less than −50 degrees Celsius.

5. The substrate support assembly of claim 1 , wherein each of the plurality of projections include:
a chucking electrode disposed therein and coupleable to a power source.

6. The substrate support assembly of claim 5 , wherein the chucking electrode is configured in a monopolar or bipolar electrode arrangement.

7. The substrate support assembly of claim 1 , wherein the body and the projections include stainless steel and/or aluminum containing materials.

8. The substrate support assembly of claim 1 , wherein the pocket width and the pocket length are about 20 millimeters (mm) to about 60 mm.

9. The substrate support assembly of claim 1 , wherein a depth of the plurality of pockets is about 0.5 mm to 1 mm.

10. The substrate support assembly of claim 1 , wherein a depth of the plurality of pockets is about 0.02 mm or less.

11. A substrate support assembly, comprising:
an edge ring coupled to a plate, the edge ring having a support surface corresponding to a portion of a surface of a substrate to be retained on the support surface;
a plurality of pixels coupled to a plurality of actuated mechanisms coupled to the substrate support assembly, each of the plurality of pixels corresponding to an actuated mechanism of the plurality of actuated mechanisms; and
a controller coupled to each actuated mechanism such that portions of pixels corresponding to the portions of the surface of the substrate to be retained are positioned to support the portions of the surface without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.

12. The substrate support assembly of claim 11 , wherein the plate includes a plurality of channels.

13. The substrate support assembly of claim 12 , wherein each channel of the plurality of channels is coupled to a channel conduit operable to be in fluid communication with a vacuum source via a vacuum flow controller and operable to be in fluid communication with a gas source via a gas flow controller.

14. The substrate support assembly of claim 11 , wherein the edge ring includes a chucking electrode disposed therein and coupleable to a power source.

15. The substrate support assembly of claim 14 , wherein the chucking electrode is configured in a monopolar or bipolar electrode arrangement.

16. The substrate support assembly of claim 11 , wherein the edge ring and the plurality of pixels include stainless steel and/or aluminum containing materials.

17. The substrate support assembly of claim 11 , wherein each actuated mechanism includes at least one of a spring mechanism, a magnet mechanism, and a pneumatic mechanism.

18. A substrate support assembly, comprising:
an edge ring coupled to a plate, the edge ring having a support surface corresponding to a portion of a surface of a substrate to be retained on the support surface;
a plurality of pixels; and
a pixel support plate coupled to an actuated mechanism, the pixel support plate having a pattern of a plurality of holes corresponding to one or more devices of the portion of the surface of the substrate to be retained such that each pixel of the plurality of pixels raised to a support position does not contact the one or more devices.

19. The substrate support assembly of claim 18 , wherein:
the plate includes a plurality of channels; and
each channel of the plurality of channels is coupled to a channel conduit operable to be in fluid communication with a vacuum source via a vacuum flow controller and operable to be in fluid communication with a gas source via a gas flow controller.

20. The substrate support assembly of claim 18 , wherein the edge ring includes a chucking electrode disposed therein and coupleable to a power source.

Assignees

• Applied Materials Inc

Inventors

• Mcmillan Wayne
• Sivaramakrishnan Visweswaren
• Olson Joseph C
• Godet Ludovic
• Meyer Timmerman Thijssen Rutger
• Argaman Naamah

Classifications

• H10P72/722

  Details of electrostatic chucks · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10P30/20

  into semiconductor materials, e.g. for doping · CPC title

• H10P72/7611

  characterised by edge profile or support profile · CPC title

• H10P72/7614 Primary

  characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title