Handling and processing double-sided devices on fragile substrates

Patent metadata

Field	Value
Publication number	US-11557987-B2
Application number	US-202117455312-A
Country	US
Kind code	B2
Filing date	Nov 17, 2021
Priority date	Dec 14, 2018
Publication date	Jan 17, 2023
Grant date	Jan 17, 2023

Abstract

Embodiments of the present disclosure generally relate to substrate support assemblies for retaining a surface of a substrate having one or more devices disposed on the surface without contacting the one or more devices and deforming the substrate, and a system having the same. In one embodiment, the substrate support assembly includes an edge ring coupled to a body of the substrate support assembly. A controller is coupled to actuated mechanisms of a plurality of pixels coupled to the body of the substrate support assembly such that portions of pixels corresponding to a portion of the surface of a substrate to be retained are positioned to support the portion without contacting one or more devices disposed on the surface of the substrate to be retained on the support surface.

First claim

What is claimed is:

1. An optical device fabrication method, comprising:
retaining a first surface of an optical device substrate on a substrate support assembly, the first surface of the optical device substrate having one or more devices disposed thereon, the retaining the first surface on the substrate support assembly comprising:
disposing the first surface on a plurality of projections coupled to a body of the substrate support assembly to form pockets defined by adjacent projections, the one or more devices disposed on the first surface and the body;

forcing a stamp to contact an imprint material disposed on a second surface of the optical device substrate opposing the first surface; and
releasing the stamp from portions of the second surface and pressurizing the pockets corresponding to the portions of the second surface, the pressurizing the pockets comprising flowing gas from a gas source to the pockets through pocket conduits in fluid communication with the gas source and the pockets.

2. The optical device fabrication method of claim 1 , further comprising providing power to a chucking electrode disposed in each of the plurality of projections to retain the first surface of the optical device substrate on the substrate support assembly.

3. The optical device fabrication method of claim of claim 2 , wherein the chucking electrode is configured in a monopolar or bipolar electrode arrangement.

4. The optical device fabrication method of claim 1 , wherein contacting the imprint material disposed on the second surface forms one or more second devices.

5. The optical device fabrication method of claim 4 , wherein the one or more second devices include first structures having sub-micron critical dimensions.

6. The optical device fabrication method of claim 1 , further comprising generating vacuum pressure from a vacuum source to the pockets through the pocket conduits in fluid communication with the vacuum source and the pockets to retain the first surface of the optical device substrate on the substrate support assembly.

7. The optical device fabrication method of claim 1 , wherein the gas is an inert gas.

8. The optical device fabrication method of claim 1 , wherein the one or more devices of the first surface include first structures having sub-micron critical dimensions.

9. The optical device fabrication method of claim 1 , wherein a depth of the pockets is about 0.5 mm to 1 mm.

10. The optical device fabrication method of claim 1 , wherein a depth of the pockets is about 0.02 mm or less.

11. An optical device fabrication method, comprising:
retaining a first surface of an optical device substrate on a substrate support assembly, the first surface of the optical device having one or more first devices disposed thereon, the retaining the first surface on the substrate support assembly comprising:
disposing the first surface on a plurality of projections coupled to a body of the substrate support assembly to form pockets defined by adjacent projections, the one or more devices disposed on the first surface and the body; and
providing power to a chucking electrode disposed in each of the plurality of projections;

forcing a stamp to contact an imprint material disposed on a second surface of the optical device substrate opposing the first surface to form one or more second devices; and
releasing the stamp from portions of the second surface and pressurizing the pockets corresponding to portions of the second surface, the pressurizing the pockets comprising flowing gas from a gas source to the pockets through pocket conduits in fluid communication with the gas source and the pockets.

12. The optical device fabrication method of claim 11 , wherein contacting the imprint material disposed on the second surface forms one or more second devices.

13. The optical device fabrication method of claim 12 , wherein the one or more second devices include first structures having sub-micron critical dimensions.

14. An optical device fabrication method, comprising:
retaining a first surface of an optical device substrate on a substrate support assembly, the first surface of the optical device having one or more devices disposed thereon, the retaining the first surface on the substrate support assembly comprising:
disposing the first surface on a plurality of projections coupled to a body of the substrate support assembly to form pockets defined by adjacent projections, the one or more devices disposed on the first surface and the body; and

maintaining the optical device substrate at a cryogenic processing temperature, the maintaining the optical device substrate at the cryogenic processing temperature comprising:
flowing gas from a gas source to the pockets through pocket conduits in fluid communication with the gas source and the pockets, the gas having a cryogenic temperature less than −50 degrees Celsius.

15. The optical device fabrication method of claim 14 , wherein an ion beam is projected to a second surface of the optical device substrate opposing the first surface, the ion beam forming one or more second devices.

16. The optical device fabrication method of claim 15 , wherein the one or more second devices include first structures having sub-micron critical dimensions.

17. The optical device fabrication method of claim 14 , further comprising providing power to a chucking electrode disposed in each of the plurality of projections to retain the first surface of the optical device substrate on the substrate support assembly.

18. The optical device fabrication method of claim 17 , wherein the chucking electrode is configured in a monopolar or bipolar electrode arrangement.

19. The optical device fabrication method of claim 14 , wherein a depth of the pockets is about 0.5 mm to 1 mm.

20. The optical device fabrication method of claim 14 , wherein a depth of the pockets is about 0.02 mm or less.

Assignees

• Applied Materials Inc

Inventors

• Mcmillan Wayne
• Sivaramakrishnan Visweswaren
• Olson Joseph C
• Godet Ludovic
• Meyer Timmerman Thijssen Rutger
• Argaman Naamah

Classifications

• H10P72/722

  Details of electrostatic chucks · CPC title

• H10P72/70

  for supporting or gripping · CPC title

• H10P30/20

  into semiconductor materials, e.g. for doping · CPC title

• G02B6/34

  utilising prism or grating {(G02B6/293 takes precedence)} · CPC title

• H02N13/00 Primary

  Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect · CPC title