Enhancing tunnel magnetoresistance in memory device comprising a memory cell with a memory element coupled between a switch and a negative resistance device
US-12183379-B2 · Dec 31, 2024 · US
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Lin Wen-Chin patents
Lin Wen-Chin is listed as an inventor on 36 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lin Wen-Chin |
| Total patents | 36 |
| First publication | Feb 19, 2015 |
| Latest publication | Dec 31, 2024 |
Notable patents
Publications ranked by popularity score, then publication date.
Method for enhancing tunnel magnetoresistance in memory device
US-2023086858-A1 · Mar 23, 2023 · US
Method for enhancing tunnel magnetoresistance in memory device
US-11532341-B2 · Dec 20, 2022 · US
Method for fabricating a semiconductor device
US-11482666-B2 · Oct 25, 2022 · US
Method for fabricating a semiconductor device
US-2022085284-A1 · Mar 17, 2022 · US
Method of forming gate
US-2021273076-A1 · Sep 2, 2021 · US
Method for enhancing tunnel magnetoresistance in memory device
US-2021249062-A1 · Aug 12, 2021 · US
Method for enhancing tunnel magnetoresistance in memory device
US-10998024-B2 · May 4, 2021 · US
Method for forming semiconductor integrated circuit structure
US-10943910-B2 · Mar 9, 2021 · US
Semiconductor integrated circuit structure
US-10923481-B2 · Feb 16, 2021 · US
Recent patents
Latest publications not already listed above.
Method for enhancing tunnel magnetoresistance in memory device
US-2021035621-A1 · Feb 4, 2021 · US
Hydrogen sensing device
US-10753917-B2 · Aug 25, 2020 · US
Planarization method
US-10734276-B2 · Aug 4, 2020 · US
Method for improving wafer surface uniformity
US-10276367-B1 · Apr 30, 2019 · US
Planarization method
US-10262869-B2 · Apr 16, 2019 · US
Semiconductor device and manufacturing method thereof
US-10249357-B1 · Apr 2, 2019 · US
Method for forming semiconductor integrated circuit structure
US-2019043866-A1 · Feb 7, 2019 · US
Semiconductor integrated circuit structure
US-2019035794-A1 · Jan 31, 2019 · US
Hydrogen sensing device
US-2018328902-A1 · Nov 15, 2018 · US
Semiconductor integrated circuit structure and method for forming the same
US-10128251-B2 · Nov 13, 2018 · US
Planarization method
US-2018277382-A1 · Sep 27, 2018 · US
Planarization method
US-2018197749-A1 · Jul 12, 2018 · US
Method of fabricating a gate cap layer
US-9972498-B2 · May 15, 2018 · US
Semiconductor integrated circuit structure and method for forming the same
US-2018076205-A1 · Mar 15, 2018 · US
Method of fabricating a semiconductor structure
US-2018033636-A1 · Feb 1, 2018 · US
Method of fabricating a gate cap layer
US-2017162396-A1 · Jun 8, 2017 · US
Method of manufacturing a semiconductor structure
US-2017162402-A1 · Jun 8, 2017 · US
Method for fabricating semiconductor device
US-9673053-B2 · Jun 6, 2017 · US
Semiconductor structure
US-2016351674-A1 · Dec 1, 2016 · US
Method for manufacturing semiconductor device with a barrier layer having overhung portions
US-9502303-B2 · Nov 22, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| United Microelectronics Corp | 27 |
| Fujian Jinhua Integrated Circuit Co Ltd | 12 |
| Taiwan Semiconductor Mfg Co Ltd | 6 |
| Univ National Chiao Tung | 2 |
| Hon Hai Prec Ind Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/038 | 14 |
| H10B12/01 | 11 |
| H10P52/403 | 11 |
| H01L21/3212 | 9 |
| H10P95/062 | 9 |