Semiconductor structure and manufacturing method thereof
US-12593493-B2 · Mar 31, 2026 · US
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Lin Ching-Ling patents
Lin Ching-Ling is listed as an inventor on 54 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lin Ching-Ling |
| Total patents | 54 |
| First publication | Jan 1, 2015 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Planarization method
US-12538767-B2 · Jan 27, 2026 · US
Semiconductor device and method for fabricating the same
US-2026013207-A1 · Jan 8, 2026 · US
Semiconductor device and method for fabricating the same
US-12439681-B2 · Oct 7, 2025 · US
Semiconductor device and method for fabricating the same
US-2025151366-A1 · May 8, 2025 · US
Planarization method
US-2025132168-A1 · Apr 24, 2025 · US
Semiconductor device and method for fabricating the same
US-2025098252-A1 · Mar 20, 2025 · US
Semiconductor structure and manufacturing method thereof
US-2024371699-A1 · Nov 7, 2024 · US
Semiconductor device and method for fabricating the same
US-2024282637-A1 · Aug 22, 2024 · US
Semiconductor device and method for fabricating the same
US-11972984-B2 · Apr 30, 2024 · US
Recent patents
Latest publications not already listed above.
Semiconductor device and method for fabricating the same
US-2023135742-A1 · May 4, 2023 · US
Semiconductor device and method for fabricating the same
US-11569133-B2 · Jan 31, 2023 · US
Semiconductor device and method for fabricating the same
US-10892194-B2 · Jan 12, 2021 · US
Semiconductor device and method for fabricating the same
US-2020328126-A1 · Oct 15, 2020 · US
Semiconductor device and method for fabricating the same
US-2020258788-A1 · Aug 13, 2020 · US
Semiconductor device and method for fabricating the same
US-10741455-B2 · Aug 11, 2020 · US
Semiconductor device and method for fabricating the same
US-10679903-B2 · Jun 9, 2020 · US
Semiconductor device and method for fabricating the same
US-2020176331-A1 · Jun 4, 2020 · US
Semiconductor device and method for fabricating the same
US-10607897-B2 · Mar 31, 2020 · US
Semiconductor device and method for fabricating the same
US-2020035568-A1 · Jan 30, 2020 · US
Semiconductor device and method for fabricating the same
US-10475709-B1 · Nov 12, 2019 · US
Semiconductor device and method for fabricating the same
US-2019172753-A1 · Jun 6, 2019 · US
Method for fabricating semiconductor device
US-10312146-B2 · Jun 4, 2019 · US
Semiconductor structure and manufacturing method thereof
US-10204981-B2 · Feb 12, 2019 · US
Method for fabricating semiconductor device
US-2019019731-A1 · Jan 17, 2019 · US
Semiconductor structure and manufacturing method thereof
US-2019013381-A1 · Jan 10, 2019 · US
Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer
US-9984974-B1 · May 29, 2018 · US
Method for fabricating semiconductor device having a patterned metal layer embedded in an interlayer dielectric layer
US-2018130742-A1 · May 10, 2018 · US
Method of fabricating semiconductor device
US-9748144-B1 · Aug 29, 2017 · US
Method for forming semiconductor device
US-9564371-B2 · Feb 7, 2017 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| United Microelectronics Corp | 54 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10D84/038 | 41 |
| H10D64/017 | 26 |
| H10D30/024 | 20 |
| H10W10/17 | 19 |
| H10D84/0151 | 18 |