Method for forming semiconductor device

Patent metadata

Field	Value
Publication number	US-9564371-B2
Application number	US-201414514374-A
Country	US
Kind code	B2
Filing date	Oct 14, 2014
Priority date	Oct 14, 2014
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A manufacturing method for forming a semiconductor device includes: first, a substrate is provided, a fin structure is formed on the substrate, and a plurality of gate structures are formed on the fin structure, next, a hard mask layer and a first photoresist layer are formed on the fin structure, an first etching process is then performed on the first photoresist layer, afterwards, a plurality of patterned photoresist layers are formed on the remaining first photoresist layer and the remaining hard mask layer, where each patterned photoresist layer is disposed right above each gate structure, and the width of each patterned photoresist is larger than the width of each gate structure, and the patterned photoresist layer is used as a hard mask to perform an second etching process to form a plurality of second trenches.

First claim

What is claimed is:

1. A manufacturing method for forming a semiconductor device, at least comprising the following steps:
providing a substrate, a fin structure is formed on the substrate, and a plurality of gate structures are formed on the fin structure;
forming an interlayer dielectric on the gate structures;
forming a hard mask layer and a first photoresist layer on the interlayer dielectric;
performing a first etching process on the first photoresist layer, to form at least one first trench in the first photoresist layer and in the hard mask layer, so as to define a region, wherein the region is overlapping the fin structures when the semiconductor device is viewed from the top view;
forming a plurality of patterned photoresist layers on the remaining hard mask layer, wherein each patterned photoresist layer is disposed right above each gate structure, and a width of each patterned photoresist is larger than a width of each gate structure, in addition, an area of the each patterned photoresist layer of the plurality of the patterned photoresist layers totally overlaps an area of each corresponding gate structure from the plurality of the gate structures when viewed in top view; and
using the remaining hard mask layer and the plurality of patterned photoresist layer as a second hard mask to perform a second etching process to form a plurality of second trenches, wherein the plurality of second trenches are only disposed within the region, and each second trench at least partially overlaps the width of the first trench.

2. The method of claim 1 , wherein the plurality of gate structures are stripe-shaped and arranged parallel to each other.

3. The method of claim 2 , wherein each fin structure and each gate structure are arranged orthogonally.

4. The method of claim 1 , wherein a ratio of the width of each patterned photoresist layer divided by the width of each gate structure is between 2˜4.

5. The method of claim 1 , wherein a ratio of the width of each patterned photoresist layer divided by a space between each two adjacent gate structures is between 0.5˜1.

6. The method of claim 1 , wherein the first photoresist layer is a multiple layer structure.

7. The method of claim 1 , after the first etching process is performed, further comprising forming a second photoresist layer on the remaining hard mask layer, and the second photoresist layer is a multiple layer structure.

8. The method of claim 1 , further comprising forming a silicide layer in each second trench.

9. The method of claim 1 , further comprising filling a conductive layer in each second trench.

10. The method of claim 1 , wherein each second trench is arranged parallel to each gate structure.

11. The method of claim 1 , further comprising forming an epitaxial layer on the fin structure, wherein each second trench exposes the epitaxial layer.

12. The method of claim 1 , wherein each second trench does not contact each gate structure directly.

13. The method of claim 1 , further comprising forming a first interlayer dielectric between each gate structure.

14. The method of claim 1 , further comprising forming a second interlayer dielectric between the plurality of gate structures and the hard mask layer.

15. The method of claim 1 , wherein the at least one first trench exposes the interlayer dielectric.

16. The method of claim 1 , wherein each second trench is not disposed right above each gate structure.

Assignees

• United Microelectronics Corp

Inventors

• Hung Ching-Wen
• Chang Tsung-Hung
• Wu Jia-Rong
• Lin Ching-Ling
• Lee Yi-Hui
• Huang Chih-Sen
• Chen Yi-Wei

Classifications

• H10P50/73

  using masks for insulating materials · CPC title

• H10W20/089

  using processes for implementing desired shapes or dispositions of the openings, e.g. double patterning · CPC title

• H10W20/069

  by forming self-aligned vias or self-aligned contact plugs · CPC title

• H01L21/823475 Primary

  Electricity · mapped topic

• H01L21/31144

  Electricity · mapped topic