Integrated circuit structure and method for forming the same
US-2025246537-A1 · Jul 31, 2025 · US
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Lee Si-Chen patents
Lee Si-Chen is listed as an inventor on 41 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Si-Chen |
| Total patents | 41 |
| First publication | Jul 16, 2015 |
| Latest publication | Jul 31, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Integrated circuit structure and method for forming the same
US-12266602-B2 · Apr 1, 2025 · US
Integrated circuit structure and method for forming the same
US-2023014503-A1 · Jan 19, 2023 · US
2D crystal hetero-structures and manufacturing methods thereof
US-11211460-B2 · Dec 28, 2021 · US
Semiconductor device and method of formation
US-11171212-B2 · Nov 9, 2021 · US
Forming semiconductor structures with two-dimensional materials
US-11152209-B2 · Oct 19, 2021 · US
Method of forming a semiconductor device using layered etching and repairing of damaged portions
US-10985019-B2 · Apr 20, 2021 · US
2d crystal hetero-structures and manufacturing methods thereof
US-2021005719-A1 · Jan 7, 2021 · US
2D crystal hetero-structures and manufacturing methods thereof
US-10784351-B2 · Sep 22, 2020 · US
Method of forming a semiconductor device using layered etching and repairing of damaged portions
US-2020266059-A1 · Aug 20, 2020 · US
Recent patents
Latest publications not already listed above.
Forming semiconductor structures with two-dimensional materials
US-2020194258-A1 · Jun 18, 2020 · US
Method of forming a semiconductor device using layered etching and repairing of damaged portions
US-10636652-B2 · Apr 28, 2020 · US
Forming semiconductor structures with two-dimensional materials
US-10541132-B2 · Jan 21, 2020 · US
Forming semicondcutor structures with two-dimensional materials
US-2019378715-A1 · Dec 12, 2019 · US
Semiconductor device and method of formation
US-2019319101-A1 · Oct 17, 2019 · US
Method of forming a semiconductor device using layered etching and repairing of damaged portions
US-2019237328-A1 · Aug 1, 2019 · US
Semiconductor device and method of formation
US-10269902-B2 · Apr 23, 2019 · US
Method of forming a semiconductor device using layered etching and repairing of damaged portions
US-10269564-B2 · Apr 23, 2019 · US
Semiconductor devices comprising 2D-materials and methods of manufacture thereof
US-10157737-B2 · Dec 18, 2018 · US
Method of manufacturing a FET using a two dimensional transition metal dichalcogenide including a low power oxygen plasma treatment
US-10147603-B2 · Dec 4, 2018 · US
2d crystal hetero-structures and manufacturing methods thereof
US-2018269291-A1 · Sep 20, 2018 · US
Method of forming a semiconductor device using layered etching and repairing of damaged portions
US-2018269059-A1 · Sep 20, 2018 · US
Semiconductor device and method of formation
US-2018122909-A1 · May 3, 2018 · US
Semiconductor Devices Comprising 2D-Materials and Methods of Manufacture Thereof
US-2018068851-A1 · Mar 8, 2018 · US
A field effect transistor using transition metal dichalcogenide and a method for forming the same
US-2018005824-A1 · Jan 4, 2018 · US
Semiconductor devices comprising 2D-materials and methods of manufacture thereof
US-9859115-B2 · Jan 2, 2018 · US
Semiconductor device and method of formation
US-9853105-B2 · Dec 26, 2017 · US
Semiconductor device and method of formation
US-2017098693-A1 · Apr 6, 2017 · US
Projection patterning with exposure mask
US-9570301-B2 · Feb 14, 2017 · US
Semiconductor device and method of formation
US-9525072-B2 · Dec 20, 2016 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Univ Nat Taiwan | 38 |
| Taiwan Semiconductor Mfg Co Ltd | 32 |
| Lee Si-Chen | 1 |
| Yang Chieh-Hung | 1 |
| Hsueh Chun-Yuan | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P14/3436 | 20 |
| H10P14/2921 | 20 |
| H01L21/02568 | 20 |
| H10D30/6757 | 18 |
| H10D62/80 | 18 |