2D crystal hetero-structures and manufacturing methods thereof

Patent metadata

Field	Value
Publication number	US-11211460-B2
Application number	US-202017027237-A
Country	US
Kind code	B2
Filing date	Sep 21, 2020
Priority date	Mar 17, 2017
Publication date	Dec 28, 2021
Grant date	Dec 28, 2021

Abstract

A method of fabricating a semiconductor device having two dimensional (2D) lateral hetero-structures includes forming alternating regions of a first metal dichalcogenide film and a second metal dichalcogenide film extending along a surface of a first substrate. The first metal dichalcogenide and the second metal dichalcogenide films are different metal dichalcogenides. Each second metal dichalcogenide film region is bordered on opposing lateral sides by a region of the first metal dichalcogenide film, as seen in cross-sectional view.

First claim

What is claimed is:

1. A semiconductor device comprising:
a patterned first metal dichalcogenide film disposed on a substrate;
a second metal dichalcogenide film disposed between adjacent portions of the patterned first metal dichalcogenide film,
wherein the first metal dichalcogenide film and the second metal dichalcogenide film are different metal dichalcogenides;
a gate dielectric layer disposed over a central portion of the second metal dichalcogenide film;
a gate electrode layer disposed over the gate dielectric layer; and
source/drain electrodes disposed over opposing end portions of the second metal dichalcogenide film.

2. The semiconductor device of claim 1 , wherein the second metal dichalcogenide film is a monolayer film.

3. The semiconductor device of claim 1 , wherein the first metal dichalcogenide film and the second metal dichalcogenide film are arranged in alternating regions.

4. The semiconductor device of claim 3 , wherein adjacent portions of the first metal dichalcogenide film are spaced-apart by a distance of 1 nm to 10 nm in the alternating regions.

5. The semiconductor device of claim 3 , wherein adjacent portions of the second metal dichalcogenide film are spaced-apart by a distance of about 5 nm to about 30 nm in the alternating regions.

6. The semiconductor device of claim 1 , wherein the substrate is made of sapphire.

7. The semiconductor device of claim 1 , wherein the first metal dichalcogenide film has a thickness of about 0.5 nm to about 10 nm.

8. The semiconductor device of claim 1 , wherein the first and second metal dichalcogenides comprise a transition metal dichalcogenide.

9. The semiconductor device of claim 8 , wherein the transition metal dichalcogenides are selected from the group consisting of WS 2 , MoS 2 , WSe 2 , MoSe 2 , WTe 2 , and MoTe 2 .

10. A semiconductor device having a two-dimensional (2D) lateral hetero-structure, comprising:
a plurality of lines of a first metal dichalcogenide film extending in a first direction disposed over a substrate,
wherein the plurality of lines are arranged in a second direction; and
a second metal dichalcogenide film disposed between adjacent lines of the plurality of lines of the first metal dichalcogenide films,
wherein the first metal dichalcogenide film and the second metal dichalcogenide film are different metal dichalcogenides,
wherein the lines have a width W L , a length L L , and a first line is spaced-apart from a second adjacent line by a distance D L , wherein D L ranges from about 0.5 W L to about 30 W L , and L L ranges from about 3 W L to about 30 W L .

11. The semiconductor device of claim 10 , wherein the second metal dichalcogenide film is a monolayer film.

12. The semiconductor device of claim 10 , further comprising:
a dielectric layer disposed over a first central portion of the second metal dichalcogenide film;
a gate electrode disposed over the dielectric layer; and
source/drain electrodes disposed over second end portions at opposing ends of the first central portion of the second metal dichalcogenide film.

13. The semiconductor device of claim 10 , wherein the first metal dichalcogenide film has a thickness of about 0.5 nm to about 10 nm.

14. The semiconductor device of claim 10 , wherein the first and second metal dichalcogenides comprise a transition metal dichalcogenide.

15. The semiconductor device of claim 14 , wherein the transition metal dichalcogenides are selected from the group consisting of WS 2 , MoS 2 , WSe 2 , MoSe 2 , WTe 2 , and MoTe 2 .

16. A semiconductor device having two-dimensional (2D) lateral hetero-structures, comprising:
a first layer of a first metal dichalcogenide comprising a plurality lines extending along a first direction and arranged along a second direction disposed over a substrate; and
a second layer of a second metal dichalcogenide disposed over the plurality of lines and the substrate,
wherein the first metal dichalcogenide and the second metal dichalcogenide are different metal dichalcogenides, and
each of the plurality of lines is bordered on opposing lateral sides by the second layer of the second metal dichalcogenide, as seen in cross-sectional view.

17. The semiconductor device of claim 16 , wherein the second metal dichalcogenide layer is a monolayer film.

18. The semiconductor device of claim 16 , further comprising:
a dielectric layer disposed over a first central portion of the second metal dichalcogenide layer;
a gate electrode disposed over the dielectric layer; and
source/drain electrodes disposed over second end portions at opposing ends of the first central portion of the second metal dichalcogenide layer.

19. The semiconductor device of claim 16 , wherein the first metal dichalcogenide layer has a thickness of about 0.5 nm to about 10 nm.

20. The semiconductor device of claim 16 , wherein the first and second metal dichalcogenides comprise a transition metal dichalcogenide selected from the group consisting of WS 2 , MoS 2 , WSe 2 , MoSe 2 , WTe 2 , and MoTe 2 .

Assignees

• Taiwan Semiconductor Mfg Co Ltd
• Univ Nat Taiwan

Inventors

• Lin Shih-Yen
• Lee Si-Chen
• Pan Samuel C
• Chen Kuan-Chao

Classifications

• H10P72/7426

  used as a support during build up manufacturing of active devices · CPC title

• H10P90/1914

  using bonding · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10P14/3436

  being chalcogenide semiconductor materials not being oxides, e.g. ternary compounds · CPC title

• H10P14/3242

  Structure · CPC title