Printed circuit board
US-12593403-B2 · Mar 31, 2026 · US
This page is not indexed by search engines while we improve data quality.
Lee Jin Uk patents
Lee Jin Uk is listed as an inventor on 127 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Jin Uk |
| Total patents | 127 |
| First publication | Feb 12, 2015 |
| Latest publication | Mar 31, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Printed circuit board
US-2026020151-A1 · Jan 15, 2026 · US
Printed circuit board
US-2025386423-A1 · Dec 18, 2025 · US
Printed circuit board
US-12495496-B2 · Dec 9, 2025 · US
Printed circuit board
US-12484148-B2 · Nov 25, 2025 · US
Printed circuit board
US-12439512-B2 · Oct 7, 2025 · US
Printed circuit board
US-2025212335-A1 · Jun 26, 2025 · US
Printed circuit board and manufacturing method for the same
US-2025203775-A1 · Jun 19, 2025 · US
Printed circuit board and method of manufacturing the same
US-2025168980-A1 · May 22, 2025 · US
Semiconductor package
US-2025125238-A1 · Apr 17, 2025 · US
Recent patents
Latest publications not already listed above.
Printed circuit board
US-12262470-B2 · Mar 25, 2025 · US
Printed circuit board
US-2025098067-A1 · Mar 20, 2025 · US
Printed circuit board
US-2025048534-A1 · Feb 6, 2025 · US
Printed circuit board
US-2025024601-A1 · Jan 16, 2025 · US
Printed circuit board
US-2025016917-A1 · Jan 9, 2025 · US
Printed circuit board
US-12022613-B2 · Jun 25, 2024 · US
Printed circuit board
US-2024196533-A1 · Jun 13, 2024 · US
Printed circuit board
US-12004296-B2 · Jun 4, 2024 · US
Printed circuit board
US-2024147620-A1 · May 2, 2024 · US
Printed circuit board
US-2024057254-A1 · Feb 15, 2024 · US
Printed circuit board
US-11903129-B2 · Feb 13, 2024 · US
Printed circuit board
US-2024049389-A1 · Feb 8, 2024 · US
Printed circuit board
US-11895771-B2 · Feb 6, 2024 · US
Printed circuit board
US-11856701-B2 · Dec 26, 2023 · US
Etching composition, a method of etching a metal barrier layer and a metal layer using the same, and method of manufacturing semiconductor device using the same
US-11795550-B2 · Oct 24, 2023 · US
Printed circuit board
US-11758657-B2 · Sep 12, 2023 · US
Printed circuit board
US-2023199951-A1 · Jun 22, 2023 · US
Printed circuit board
US-2023199955-A1 · Jun 22, 2023 · US
Housing-integrated board mating connector and method of manufacturing same
US-11682870-B2 · Jun 20, 2023 · US
Printed circuit board
US-2023156922-A1 · May 18, 2023 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electro Mech | 50 |
| Soulbrain Co Ltd | 42 |
| Gigalane Co Ltd | 29 |
| Samsung Electronics Co Ltd | 8 |
| Samsung Sdi Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10P50/283 | 43 |
| C09K13/06 | 43 |
| H01L21/31111 | 41 |
| H05K1/115 | 32 |
| H10B41/27 | 23 |