Printed circuit board

Patent metadata

Field	Value
Publication number	US-11758657-B2
Application number	US-202117475747-A
Country	US
Kind code	B2
Filing date	Sep 15, 2021
Priority date	Mar 31, 2021
Publication date	Sep 12, 2023
Grant date	Sep 12, 2023

Abstract

A printed circuit board includes a first insulating layer; a first wiring layer disposed on one surface of the first insulating layer and including a pad; a second insulating layer disposed on the one surface of the first insulating layer and covering the first wiring layer; a second wiring layer disposed on one surface of the second insulating layer and including a metal pattern; a third insulating layer disposed on the one surface of the second insulating layer and covering the second wiring layer; and a cavity extending through each of the second and third insulating layers, and having a bottom surface and a sidewall respectively exposing the pad of the first wiring layer and the metal pattern of the second wiring layer. The cavity includes a non-through groove in the one surface of the first insulating layer.

First claim

What is claimed is:

1. A printed circuit board comprising:
a first insulating layer;
a first wiring layer disposed on one surface of the first insulating layer and including a pad;
a second insulating layer disposed on the one surface of the first insulating layer and covering the first wiring layer;
a second wiring layer disposed on one surface of the second insulating layer and including a metal pattern;
a third insulating layer disposed on the one surface of the second insulating layer and covering the second wiring layer; and
a cavity extending through each of the second and third insulating layers, and having a bottom surface and a sidewall respectively exposing the pad of the first wiring layer and the metal pattern of the second wiring layer,
wherein the cavity includes a non-through groove in the first insulating layer such that the non-through groove has a side surface defining an obtuse angle with the bottom surface.

2. The printed circuit board of claim 1 , wherein the metal pattern is a mask pattern and comprises copper (Cu).

3. The printed circuit board of claim 1 , wherein the metal pattern of the second wiring layer is provided as a first metal pattern and a second metal pattern, and
wherein the first metal pattern is exposed through one sidewall of the cavity and the second metal pattern is exposed through another sidewall of the cavity facing the one sidewall in one direction.

4. The printed circuit board of claim 3 , wherein lengths of the first and second metal patterns respectively exposed through the one sidewall and the another sidewall of the cavity in the one direction are different.

5. The printed circuit board of claim 1 , wherein the metal pattern of the second wiring layer extends to surround the cavity.

6. The printed circuit board of claim 1 , wherein the metal pattern of the second wiring layer is provided as a plurality of metal patterns, and
wherein the cavity exposes the plurality of metal patterns.

7. The printed circuit board of claim 1 , further comprising an electronic component disposed in the cavity and connected to the exposed pad of the first wiring layer.

8. The printed circuit board of claim 1 , further comprising:
a third wiring layer disposed on one surface of the third insulating layer;
a fourth insulating layer disposed on the one surface of the third insulating layer and covering the third wiring layer;
a fourth wiring layer disposed on one surface of the fourth insulating layer; and
a via connecting adjacent two wiring layers of the first to fourth wiring layers,
wherein the via has a tapered shape in a direction towards the first wiring layer, and
the cavity further extends through the fourth insulating layer.

9. The printed circuit board of claim 8 , further comprising a solder resist layer disposed on the one surface of the fourth insulating layer,
wherein the cavity extends through the solder resist.

10. A printed circuit board comprising:
a first insulating layer having one surface and another surface opposing the one surface, and including a first opening;
a first wiring layer disposed on the one surface of the first insulating layer and including a metal pattern;
a second insulating layer disposed on the one surface of the first insulating layer, covering the first wiring layer, and including a second opening having a diameter larger than a diameter of the first opening, and exposing the metal pattern such that a side surface of the second opening defines an acute outer angle with an upper surface of the metal pattern;
a second wiring layer disposed on the another surface of the first insulating layer and including a pad; and
a third insulating layer disposed on the another surface of the first insulating layer and covering the second wiring layer,
wherein the first opening extends into the third insulating layer to expose the pad of the second wiring layer, and
the pad of the second wiring layer is spaced apart from a sidewall of the first opening.

11. The printed circuit board of claim 10 , wherein the metal pattern of the first wiring layer is a mask pattern and comprises copper (Cu).

12. The printed circuit board of claim 10 , wherein each of the first and second openings has one sidewall and another sidewall facing the one sidewall in one direction,
wherein the one sidewall and the another sidewall of the first opening are spaced apart from the one sidewall and the another sidewall of the second opening, respectively.

13. The printed circuit board of claim 12 , wherein the metal pattern is provided as a first metal pattern and a second metal pattern,
wherein the first metal pattern is exposed through the one sidewall of the second opening and the second metal pattern is exposed through the another sidewall of the second opening,
wherein lengths of the first and second metal patterns respectively exposed through the one sidewall and the another sidewall of the second opening in the one direction are different.

14. The printed circuit board of claim 10 , further comprising:
a third wiring layer disposed on one surface of the third insulating layer;
a first via connecting the first and second wiring layers; and
a second via connecting the second and third wiring layers,
wherein the first and second vias have a tapered shape in a direction toward the second wiring layer.

15. The printed circuit board of claim 10 , further comprising an electronic component connected to the exposed pad of the second wiring layer.

16. A printed circuit board comprising:
a plurality of insulating layers;
a second wiring layer including a metal pattern having a portion disposed between two of the plurality of insulating layers;
a cavity extending through at least the two of the plurality of insulating layers; and
a first wiring layer disposed in a first insulating layer of the plurality of insulating layers, and including a pad disposed in the cavity,
wherein one surface of the metal pattern defines a portion of a sidewall of the cavity,
the cavity extends into a portion of the first insulating layer, and
the metal pattern extends to surround the cavity.

17. The printed circuit board of claim 16 , wherein the metal pattern of the second wiring layer is provided as a first metal pattern and a second metal pattern disposed on opposing sidewalls of the cavity.

18. The printed circuit board of claim 17 , wherein a length of a portion of the first metal pattern extending in the cavity is greater than a portion of the second metal pattern extending in the cavity.

19. The printed circuit board of claim 17 , wherein the first metal pattern includes a portion extending in the cavity, and the second metal pattern includes a side surface flushed with a side surface of one of the two insulating layers.

20. The printed circuit board of claim 16 , wherein the metal pattern is spaced apart from a signal pattern of the printed circuit board.

21. The printed circuit board of claim 16 , wherein the metal pattern is spaced apart from a signal pattern and a ground pattern of the printed circuit board.

Assignees

• Samsung Electro Mech

Inventors

• Kim Eun Sun
• Lee Jin Uk
• You Young Hun

Classifications

• H05K1/05 Primary

  Insulated {conductive substrates, e.g. insulated} metal substrate · CPC title

• H05K3/4697 Primary

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H05K1/185 Primary

  associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title

• H05K1/09

  Use of materials for the {conductive, e.g. } metallic pattern · CPC title