Printed circuit board

Patent metadata

Field	Value
Publication number	US-12495496-B2
Application number	US-202318104526-A
Country	US
Kind code	B2
Filing date	Feb 1, 2023
Priority date	Aug 2, 2022
Publication date	Dec 9, 2025
Grant date	Dec 9, 2025

Abstract

A printed circuit board includes: a bridge including a first insulating material, a wiring pattern disposed in the first insulating layer, a metal post disposed on the first insulating material and connected to the wiring pattern, and a second insulating material disposed on the first insulating material and covering at least a portion of the metal post; a first build-up insulating material disposed around the bridge; and a first redistribution pattern disposed on the second insulating material and the first build-up insulating material and including a metal pad connected to the metal post.

First claim

What is claimed is:

1 . A printed circuit board comprising:
a bridge including a first insulating material, a wiring pattern disposed in the first insulating layer, a metal post disposed on the first insulating material and connected to the wiring pattern, and a second insulating material disposed on the first insulating material and covering at least a portion of the metal post; a first build-up insulating material disposed around the bridge; and a first redistribution pattern disposed on the second insulating material and the first build-up insulating material and including a metal pad connected to the metal post, wherein the second insulating material has transparency, higher than transparency of at least one of the first insulating material and the first build-up insulating material.

2 . The printed circuit board of claim 1 , wherein
an upper surface of the metal post is substantially coplanar with an upper surface of the second insulating material.

3 . The printed circuit board of claim 1 , wherein
at least a portion of the metal post protrudes upwardly of an upper surface of the second insulating material.

4 . The printed circuit board of claim 3 , wherein
the metal pad is disposed on the upper surface of the second insulating material to cover the at least protruding portion of the metal post.

5 . The printed circuit board of claim 4 , wherein
the metal pad includes a seed layer continuously disposed on the upper surface of the second insulating material, a side surface of the at least protruding portion of the metal post, and an upper surface of the at least protruding portion of the metal post.

6 . The printed circuit board of claim 1 , further comprising:
a second redistribution pattern disposed in the first build-up insulating material and connected to the first redistribution pattern through a first via.

7 . The printed circuit board of claim 6 , further comprising:
a second build-up insulating material disposed on a lower side of the first build-up insulating material; and a third redistribution pattern disposed in the second build-up insulating material and connected to the second redistribution pattern through a second via.

8 . The printed circuit board of claim 7 , wherein
the bridge is attached to an upper surface of the second build-up insulating material through an adhesive.

9 . The printed circuit board of claim 1 , further comprising:
a resist disposed on the bridge and the first build-up insulating material and covering at least a portion of the first redistribution pattern, wherein an upper surface of the first redistribution pattern and an upper surface of the resist have a step difference.

10 . The printed circuit board of claim 9 , wherein
the upper surface of the first redistribution pattern is disposed above the upper surface of the resist, and the resist has a thickness, less than a thickness of the first redistribution pattern.

11 . The printed circuit board of claim 1 , further comprising:
a third build-up insulating material disposed on the bridge and the first build-up insulating material; and a fourth redistribution pattern disposed on the third build-up insulating material and connected to the first redistribution pattern through a third via.

12 . The printed circuit board of claim 1 , wherein
an upper surface of the second insulating material protrudes upwardly of an upper surface of the first build-up insulating material.

13 . The printed circuit board of claim 1 , wherein
the first build-up insulating material is in contact with a side surface of the bridge.

14 . The printed circuit board of claim 1 , wherein
the first build-up insulating material is provided with a cavity in which the bridge is disposed.

15 . The printed circuit board of claim 14 , wherein
the first build-up insulating material is spaced apart from the bridge.

16 . The printed circuit board of claim 1 , wherein
each of the first and second insulating materials includes an organic insulating material.

17 . A printed circuit board comprising:
a bridge including a first insulating material, a wiring pattern disposed in the first insulating layer, a metal post disposed on the first insulating material and connected to the wiring pattern, and a second insulating material disposed on the first insulating material and covering at least a portion of the metal post; a first build-up insulating material covering at least a portion of the bridge; and a first redistribution pattern disposed on the second insulating material and the first build-up insulating material and including a metal pad connected to the metal post, wherein an upper surface of the first build-up insulating material is provided with a groove portion exposing at least a portion of the second insulating material around the bridge.

18 . The printed circuit board of claim 17 , wherein
an upper surface of the first build-up insulating material has a step difference at the groove portion.

19 . The printed circuit board of claim 17 , wherein
a wall surface of the groove portion has a tapered shape.

20 . A printed circuit board comprising:
a bridge including a first insulating material, a wiring pattern disposed in the first insulating layer, a metal post disposed on the first insulating material and connected to the wiring pattern, and a second insulating material disposed on the first insulating material and covering at least a portion of the metal post; a first build-up insulating material disposed around the bridge; and a first redistribution pattern disposed on the second insulating material and the first build-up insulating material and including a metal pad connected to the metal post, wherein the first redistribution pattern is in contact with the first build-up insulating material, and among an upper surface and a side surface of the first insulating material, the second insulating material is disposed only on the first insulating material.

21 . The printed circuit board of claim 20 , wherein
an upper surface of the metal post is substantially coplanar with an upper surface of the second insulating material.

22 . The printed circuit board of claim 20 , wherein
at least a portion of the metal post protrudes upwardly of an upper surface of the second insulating material.

23 . The printed circuit board of claim 20 , further comprising:
a resist disposed on the bridge and the first build-up insulating material and covering at least a portion of the first redistribution pattern, wherein an upper surface of the first redistribution pattern and an upper surface of the resist have a step difference.

24 . The printed circuit board of claim 20 , further comprising:
a third build-up insulating material disposed on the bridge and the first build-up insulating material; and a fourth redistribution pattern disposed on the third build-up insulating material, and connected to the first redistribution pattern through one via.

25 . The printed circuit board of claim 20 , wherein
the first build-up insulating material is in contact with a side surface of the bridge.

26 . The printed circuit board of claim 20 , wherein
the first build-up insulating material is provided with a cavity in which the bridge is disposed, and the first build-up insulating material is spaced apart from the bridge.

Assignees

• Samsung Electro Mech

Inventors

• Lee Jin Uk
• Han Youn Gyu
• Park Chang Hwa
• Lee Yong Duk

Classifications

• H10W70/618

  the bridge chips being embedded in the package substrates, interposers or redistribution layers · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/072

  of bump connectors · CPC title

• H10W72/227

  Multiple bumps having different sizes · CPC title

• H10W72/07252

  changes in structures or sizes · CPC title