Printed circuit board, electronic component-embedded substrate, and manufacturing method thereof
US-2022039261-A1 · Feb 3, 2022 · US
Printed circuit board
US11903129B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-11903129-B2 |
| Application number | US-202217691772-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 10, 2022 |
| Priority date | Nov 9, 2021 |
| Publication date | Feb 13, 2024 |
| Grant date | Feb 13, 2024 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
First claim
Opening claim text (preview).
What is claimed is: 1. A printed circuit board comprising: a first insulating material; and a second insulating material disposed on one surface of the first insulating material in a stacking direction, and including first and second cavities having depths different from each other, wherein at least one groove portion is disposed in a side surface, and spaced apart in the stacking direction from a bottom surface, of each of the first and second cavities, and wherein the at least one groove portion includes an end portion covered by the second insulating material in a direction perpendicular to the stacking direction. 2. The printed circuit board of claim 1 , wherein the first and second cavities are spaced apart from each other in the direction perpendicular to the stacking direction. 3. The printed circuit board of claim 1 , wherein the groove portion of each of the first and second cavities is filled with a metal material. 4. The printed circuit board of claim 1 , further comprising a metal layer disposed on the bottom surface of one of the first and second cavities. 5. The printed circuit board of claim 4 , wherein the metal layer protrudes from the bottom surface of the one of the first and second cavities. 6. The printed circuit board of claim 1 , further comprising a resin layer including a different material from the second insulating material, wherein the resin layer is provided as some of the bottom surface and the side surface of one of the first and second cavities. 7. The printed circuit board of claim 1 , further comprising a through hole penetrating through both the first and second insulating materials and connected to the bottom surface of one of the first and second cavities. 8. The printed circuit board of claim 1 , further comprising: an accommodating groove formed in the first insulating material; and an electronic component mounted in the accommodating groove and embedded in the second insulating material. 9. The printed circuit board of claim 1 , further comprising a solder resist layer disposed on one surface of the second insulating material.
Assignees
Inventors
Classifications
- H05K1/119Primary
Details of rigid insulating substrates therefor, e.g. three-dimensional details (H05K1/117 takes precedence) · CPC title
associated with components mounted in and supported by recessed areas of the PCBs · CPC title
of blind holes, i.e. having a metal layer at the bottom · CPC title
combined with laser drilling through a metal layer · CPC title
Mechanical working of the substrate, e.g. drilling or punching (H05K3/0008 takes precedence) · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US11903129B2 cover?
- A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.
- Who is the assignee on this patent?
- Samsung Electro Mech
- What technology area does this patent fall under?
- Primary CPC classification H05K1/119. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Feb 13 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).