Semiconductor package electrical contact structures and related methods
US-2026047368-A1 · Feb 12, 2026 · US
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Kurose Eiji patents
Kurose Eiji is listed as an inventor on 64 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Kurose Eiji |
| Total patents | 64 |
| First publication | Dec 7, 2017 |
| Latest publication | Feb 12, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Semiconductor package electrical contacts and related methods
US-2026026271-A1 · Jan 22, 2026 · US
Silicon-on-insulator die support structures and related methods
US-2026018417-A1 · Jan 15, 2026 · US
Semiconductor devices having die support structures and related methods
US-2025349549-A1 · Nov 13, 2025 · US
Die sidewall coatings and related methods
US-2025349550-A1 · Nov 13, 2025 · US
Semiconductor package electrical contact structures and related methods
US-12469709-B2 · Nov 11, 2025 · US
Silicon-on-insulator die support structures and related methods
US-12444609-B2 · Oct 14, 2025 · US
Semiconductor package electrical contacts and related methods
US-12431359-B2 · Sep 30, 2025 · US
Multi-faced molded semiconductor package and related methods
US-2025293032-A1 · Sep 18, 2025 · US
Semiconductor packages with die including cavities and related methods
US-12374554-B2 · Jul 29, 2025 · US
Recent patents
Latest publications not already listed above.
Die sidewall coatings and related methods
US-12374555-B2 · Jul 29, 2025 · US
Semiconductor package stress balance structures and related methods
US-2025232979-A1 · Jul 17, 2025 · US
Semiconductor package stress balance structures and related methods
US-2025232978-A1 · Jul 17, 2025 · US
Multi-faced molded semiconductor package and related methods
US-12341014-B2 · Jun 24, 2025 · US
Semiconductor package stress balance structures and related methods
US-12230502-B2 · Feb 18, 2025 · US
Structure and method for power metal lines
US-2024379603-A1 · Nov 14, 2024 · US
Die sidewall coatings and related methods
US-2024332025-A1 · Oct 3, 2024 · US
Die sidewall coatings and related methods
US-12040192-B2 · Jul 16, 2024 · US
Methods of forming semiconductor packages with back side metal
US-12040310-B2 · Jul 16, 2024 · US
Semiconductor packages with die including cavities and related methods
US-2024203744-A1 · Jun 20, 2024 · US
Semiconductor packages with die including cavities
US-11908699-B2 · Feb 20, 2024 · US
Backmetal removal methods
US-11901184-B2 · Feb 13, 2024 · US
Semiconductor packages with die support structure for thin die
US-11894234-B2 · Feb 6, 2024 · US
Molded semiconductor package and related methods
US-2024006363-A1 · Jan 4, 2024 · US
Molded semiconductor package and related methods
US-11791297-B2 · Oct 17, 2023 · US
Methods of forming semiconductor packages with back side metal
US-2023118179-A1 · Apr 20, 2023 · US
Methods of forming semiconductor packages with back side metal
US-11562981-B2 · Jan 24, 2023 · US
Semiconductor package electrical contact structures and related methods
US-2022384204-A1 · Dec 1, 2022 · US
Die sidewall coatings and related methods
US-2022351977-A1 · Nov 3, 2022 · US
Semiconductor packages with thin die and related methods
US-2022351978-A1 · Nov 3, 2022 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Semiconductor Components Ind Llc | 61 |
| Semiconductor Components Ind | 3 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W72/0198 | 62 |
| H10W74/014 | 62 |
| H10P54/00 | 60 |
| H01L21/561 | 59 |
| H10W74/016 | 57 |