Semiconductor package electrical contacts and related methods

Patent metadata

Field	Value
Publication number	US-12431359-B2
Application number	US-202217662786-A
Country	US
Kind code	B2
Filing date	May 10, 2022
Priority date	Aug 17, 2017
Publication date	Sep 30, 2025
Grant date	Sep 30, 2025

Abstract

Implementations of a semiconductor package may include a semiconductor die including a first side and a second side, the first side of the semiconductor die including one or more electrical contacts; and an organic material covering at least the first side of the semiconductor die. Implementations may include where the one or more electrical contacts extend through one or more openings in the organic material; a metal-containing layer coupled to the one or more electrical contacts; and one or more slugs coupled to one of a first side of the semiconductor die, a second side of the semiconductor die, or both the first side of the semiconductor die and the second side of the semiconductor die.

First claim

What is claimed is:

1. A semiconductor package, comprising:
a semiconductor die comprising a first side and a second side, the first side of the semiconductor die coupled to one or more electrical contacts;
an organic material covering at least the first side of the semiconductor die, wherein the one or more electrical contacts extend through one or more openings in the organic material;
a metal-containing layer comprised in the one or more electrical contacts; and
one or more slugs directly coupled to an outer surface of the metal-containing layer;
wherein the outer surface of the metal-containing layer is coplanar with an outermost surface of the organic material.

2. The package of claim 1 , wherein the metal-containing layer is a solder resist layer.

3. The package of claim 1 , wherein the package comprises a single slug.

4. The package of claim 1 , wherein the slug is configured to support wirebonding.

5. The package of claim 1 , wherein the organic material is directly coupled to five sides of the semiconductor die.

Assignees

• Semiconductor Components Ind Llc

Inventors

• Lin Yusheng
• Seddon Michael J
• Carney Francis J
• Noma Takashi
• Kurose Eiji

Classifications

• H10W72/0198

  batch processes · CPC title

• H10W72/879

  Bump connectors and bond wires · CPC title

• H10W72/5434

  the connected ends being on auxiliary connecting means on bond pads, e.g. on other bond wires · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/9415

  relative to the surface, e.g. recessed, protruding · CPC title