Semiconductor package device
US-12519051-B2 · Jan 6, 2026 · US
This page is not indexed by search engines while we improve data quality.
Ko Youngchan patents
Ko Youngchan is listed as an inventor on 77 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Ko Youngchan |
| Total patents | 77 |
| First publication | Oct 1, 2020 |
| Latest publication | Jan 6, 2026 |
Notable patents
Publications ranked by popularity score, then publication date.
Method of fabricating a semiconductor package
US-2025279366-A1 · Sep 4, 2025 · US
Semiconductor package
US-2025273637-A1 · Aug 28, 2025 · US
Semiconductor package and method of manufacturing the semiconductor package
US-2025273577-A1 · Aug 28, 2025 · US
Semiconductor package
US-12394708-B2 · Aug 19, 2025 · US
Method of fabricating a semiconductor package
US-12334445-B2 · Jun 17, 2025 · US
Semiconductor package including interposer and method for manufacturing the same
US-2025192019-A1 · Jun 12, 2025 · US
Semiconductor package including interposer and method for manufacturing the same
US-2025192018-A1 · Jun 12, 2025 · US
Wiring substrate and semiconductor package including a substrate wiring pattern
US-2025192013-A1 · Jun 12, 2025 · US
Semiconductor package
US-12327826-B2 · Jun 10, 2025 · US
Recent patents
Latest publications not already listed above.
Semiconductor packages having wiring patterns
US-12278191-B2 · Apr 15, 2025 · US
Semiconductor package
US-2025118646-A1 · Apr 10, 2025 · US
Semiconductor package
US-12261105-B2 · Mar 25, 2025 · US
Semiconductor package and method of manufacturing the semiconductor package
US-2025062221-A1 · Feb 20, 2025 · US
Semiconductor package with improved structural stability
US-2025062240-A1 · Feb 20, 2025 · US
Semiconductor package and manufacturing method thereof
US-2025006696-A1 · Jan 2, 2025 · US
Semiconductor package
US-12183665-B2 · Dec 31, 2024 · US
Semiconductor package
US-2024421034-A1 · Dec 19, 2024 · US
Semiconductor package and method of manufacturing the semiconductor package
US-12159826-B2 · Dec 3, 2024 · US
Semiconductor package
US-2024347468-A1 · Oct 17, 2024 · US
Semiconductor package
US-12119305-B2 · Oct 15, 2024 · US
Semiconductor package
US-2024321728-A1 · Sep 26, 2024 · US
Semiconductor package
US-12094817-B2 · Sep 17, 2024 · US
Semiconductor package
US-12046562-B2 · Jul 23, 2024 · US
Methods of manufacturing semiconductor packages
US-12040297-B2 · Jul 16, 2024 · US
Semiconductor packages and method for fabricating the same
US-2024222280-A1 · Jul 4, 2024 · US
Semiconductor package
US-12021020-B2 · Jun 25, 2024 · US
Fan-out type semiconductor package and method of manufacturing the same
US-12002798-B2 · Jun 4, 2024 · US
Semiconductor package
US-2024162133-A1 · May 16, 2024 · US
Semiconductor package
US-11935847-B2 · Mar 19, 2024 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 77 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H10W90/00 | 64 |
| H10W90/724 | 61 |
| H10W90/701 | 61 |
| H10W70/685 | 61 |
| H10W70/60 | 54 |